Architectures BABAK MATINPOUR and JOY LASKAR _ Describes the actual implementation of receiver architectures from the initial design to an IC-based product _ Presents many tricks-of-the-trade not usually covered in textbooks _ Covers a range of practical issues including semiconductor technology selection, cost versus performance, yield, packaging, prototype development, testing, and analysis _ Discusses architectures that are employed in modern broadband wireless systems
Architectures BABAK MATINPOUR and JOY LASKAR _ Describes the actual implementation of receiver architectures from the initial design to an IC-based product _ Presents many tricks-of-the-trade not usually covered in textbooks _ Covers a range of practical issues including semiconductor technology selection, cost versus performance, yield, packaging, prototype development, testing, and analysis _ Discusses architectures that are employed in modern broadband wireless systems
JOY LASKAR, PhD, is the Joseph M. Pettit Professor of Electrical and Computer Engineering at the Georgia Institute of Technology. He is the author of over 200 technical papers and has fifteen patents pending. Professor Laskar has also received numerous awards for his work, including the Army Research Office's Young Investigator Award, the National Science Foundation's CAREER Award, and the IEEE Rappaport Award. He is Director of the Georgia Electronic Design Center (GEDC). BABAK MATINPOUR, PhD, is the cofounder and vice president of VT Silicon Inc., a fables wireless start-up developing next generation Ics for 3G mobile phones. Dr. Matinpour has published over twenty IEEE papers and presented several invited talks on GaAs and SiGe RF ICs. SUDIPTO CHAKRABORTY, PhD, is a senior research engineer in the School of Electrical and Computer Engineering at the Georgia Institute of Technology, Atlanta, Georgia, where he is involved in analysis, design, and characterization of advanced wired and wireless circuits and systems towards advanced communication technologies using silicon-based processes. Dr. Chakraborty has authored or coauthored over thirty technical articles, presented several invited talks in the area of integrated transceiver design, and has two patents pending.
Inhaltsangabe
Preface. Acknowledgments. 1 INTRODUCTION. 1.1 Current State of the Art. 2 RECEIVER SYSTEM DESIGN. 2.1 Frequency Planning. 2.2 Link Budget Analysis. 2.3 Propagation Effects. 2.4 Interface Planning. 2.5 Conclusion. 3 REVIEW OF RECEIVER ARCHITECTURES. 3.1 Heterodyne Receivers. 3.2 Image Reject Receivers. 3.3 Zero IF Receivers. 3.4 Low IF Receivers. 3.5 I ssues in Direct Conversion Receivers. 3.6 Architecture Comparison and Trade-off. 3.7 Conclusion. 4 SILICON-BASED RECEIVER DESIGN. 4.1 Receiver Architecture and Design. 4.2 Circuit Design. 4.3 Receiver Design Steps. 4.4 Layout Considerations. 4.5 Characterization of Receiver Front-Ends. 4.6 Measurement Results and Discussions. 4.7 Conclusion. 5 SUBHARMONIC RECEIVER DESIGNS. 5.1 Illustration of Subharmonic Techniques. 5.2 Mixing Using Antisymmetric I-V Characteristics. 5.3 Impact of Mismatch Effects. 5.4 DC Offset Cancellation Mechanisms. 5.5 Experimental Verification of DC Offset. 5.6 Waveform Shaping Before Mixing. 5.7 Design Steps for APDP-Based Receivers. 5.8 Architectural Illustration. 5.9 Fully Monolithic Receiver Design Using Passive APDP Cores. 5.10 Reconfigurable Multiband Subharmonic Front-Ends. 5.11 Conclusion. 6 ACTIVE SUBHARMONIC RECEIVER DESIGNS. 6.1 Stacking of Switching Cores. 6.2 Parallel Transistor Stacks. 6.3 Extension to Higher-Order LO Subharmonics. 6.4 Multiple Phase Signal Generation from Oscillators. 6.5 Future Direction and Conclusion. 7 DESIGN AND INTEGRATION OF PASSIVE COMPONENTS. 7.1 System on Package (SoP). 7.2 On-Chip Inductors. 7.3 Capacitors. 7.4 Differentially Driven Inductors. 7.5 Transformers. 7.6 On-Chip Filters. 7.7 On-Wafer Antennas. 7.8 Wafer-Level Packaging. 7.9 Conclusion. 8 DESIGN FOR INTEGRATION. 8.1 System Design Considerations. 8.2 IC Floor Plan. 8.3 Packaging Considerations. 8.4 Conclusion. 9 FUTURE TRENDS. 9.1 CMOS Cellphones. 9.2 Multiband, Multimode Wireless Solutions. 9.3 60 GHz Subsystems in Silicon! 9.4 Interchip Communications. 9.5 Ultrawideband Communication Technology. 9.6 Diversity Techniques. 9.7 Conclusion. Index.
