Joy Laskar, Babak Matinpour, Sudipto Chakraborty
Modern Receiver Front-Ends (eBook, PDF)
Systems, Circuits, and Integration
136,99 €
136,99 €
inkl. MwSt.
Sofort per Download lieferbar
0 °P sammeln
136,99 €
Als Download kaufen
136,99 €
inkl. MwSt.
Sofort per Download lieferbar
0 °P sammeln
Jetzt verschenken
Alle Infos zum eBook verschenken
136,99 €
inkl. MwSt.
Sofort per Download lieferbar
Alle Infos zum eBook verschenken
0 °P sammeln
Joy Laskar, Babak Matinpour, Sudipto Chakraborty
Modern Receiver Front-Ends (eBook, PDF)
Systems, Circuits, and Integration
- Format: PDF
- Merkliste
- Auf die Merkliste
- Bewerten Bewerten
- Teilen
- Produkt teilen
- Produkterinnerung
- Produkterinnerung
Bitte loggen Sie sich zunächst in Ihr Kundenkonto ein oder registrieren Sie sich bei
bücher.de, um das eBook-Abo tolino select nutzen zu können.
Hier können Sie sich einloggen
Hier können Sie sich einloggen
Sie sind bereits eingeloggt. Klicken Sie auf 2. tolino select Abo, um fortzufahren.
Bitte loggen Sie sich zunächst in Ihr Kundenkonto ein oder registrieren Sie sich bei bücher.de, um das eBook-Abo tolino select nutzen zu können.
Architectures BABAK MATINPOUR and JOY LASKAR * Describes the actual implementation of receiver architectures from the initial design to an IC-based product * Presents many tricks-of-the-trade not usually covered in textbooks * Covers a range of practical issues including semiconductor technology selection, cost versus performance, yield, packaging, prototype development, testing, and analysis * Discusses architectures that are employed in modern broadband wireless systems
- Geräte: PC
- mit Kopierschutz
- eBook Hilfe
- Größe: 3.23MB
Andere Kunden interessierten sich auch für
- Inder BahlFundamentals of RF and Microwave Transistor Amplifiers (eBook, PDF)172,99 €
- Apostolos GeorgiadisMicrowave and Millimeter Wave Circuits and Systems (eBook, PDF)114,99 €
- Gabriel M. RebeizRF MEMS (eBook, PDF)168,99 €
- Lei ZhuMicrowave Bandpass Filters for Wideband Communications (eBook, PDF)111,99 €
- Chris J. MyersAsynchronous Circuit Design (eBook, PDF)152,99 €
- George D. VendelinMicrowave Circuit Design Using Linear and Nonlinear Techniques (eBook, PDF)191,99 €
- Ingo WolffCoplanar Microwave Integrated Circuits (eBook, PDF)173,99 €
-
-
-
Architectures BABAK MATINPOUR and JOY LASKAR * Describes the actual implementation of receiver architectures from the initial design to an IC-based product * Presents many tricks-of-the-trade not usually covered in textbooks * Covers a range of practical issues including semiconductor technology selection, cost versus performance, yield, packaging, prototype development, testing, and analysis * Discusses architectures that are employed in modern broadband wireless systems
Dieser Download kann aus rechtlichen Gründen nur mit Rechnungsadresse in A, B, BG, CY, CZ, D, DK, EW, E, FIN, F, GR, HR, H, IRL, I, LT, L, LR, M, NL, PL, P, R, S, SLO, SK ausgeliefert werden.
Produktdetails
- Produktdetails
- Verlag: John Wiley & Sons
- Seitenzahl: 240
- Erscheinungstermin: 9. April 2004
- Englisch
- ISBN-13: 9780471474869
- Artikelnr.: 37302137
- Verlag: John Wiley & Sons
- Seitenzahl: 240
- Erscheinungstermin: 9. April 2004
- Englisch
- ISBN-13: 9780471474869
- Artikelnr.: 37302137
JOY LASKAR, PhD, is the Joseph M. Pettit Professor of Electrical and Computer Engineering at the Georgia Institute of Technology. He is the author of over 200 technical papers and has fifteen patents pending. Professor Laskar has also received numerous awards for his work, including the Army Research Office's Young Investigator Award, the National Science Foundation's CAREER Award, and the IEEE Rappaport Award. He is Director of the Georgia Electronic Design Center (GEDC). BABAK MATINPOUR, PhD, is the cofounder and vice president of VT Silicon Inc., a fables wireless start-up developing next generation Ics for 3G mobile phones. Dr. Matinpour has published over twenty IEEE papers and presented several invited talks on GaAs and SiGe RF ICs. SUDIPTO CHAKRABORTY, PhD, is a senior research engineer in the School of Electrical and Computer Engineering at the Georgia Institute of Technology, Atlanta, Georgia, where he is involved in analysis, design, and characterization of advanced wired and wireless circuits and systems towards advanced communication technologies using silicon-based processes. Dr. Chakraborty has authored or coauthored over thirty technical articles, presented several invited talks in the area of integrated transceiver design, and has two patents pending.
Preface. Acknowledgments. 1 INTRODUCTION. 1.1 Current State of the Art. 2
RECEIVER SYSTEM DESIGN. 2.1 Frequency Planning. 2.2 Link Budget Analysis.
2.3 Propagation Effects. 2.4 Interface Planning. 2.5 Conclusion. 3 REVIEW
OF RECEIVER ARCHITECTURES. 3.1 Heterodyne Receivers. 3.2 Image Reject
Receivers. 3.3 Zero IF Receivers. 3.4 Low IF Receivers. 3.5 I ssues in
Direct Conversion Receivers. 3.6 Architecture Comparison and Trade-off. 3.7
Conclusion. 4 SILICON-BASED RECEIVER DESIGN. 4.1 Receiver Architecture and
Design. 4.2 Circuit Design. 4.3 Receiver Design Steps. 4.4 Layout
Considerations. 4.5 Characterization of Receiver Front-Ends. 4.6
Measurement Results and Discussions. 4.7 Conclusion. 5 SUBHARMONIC RECEIVER
DESIGNS. 5.1 Illustration of Subharmonic Techniques. 5.2 Mixing Using
Antisymmetric I-V Characteristics. 5.3 Impact of Mismatch Effects. 5.4 DC
Offset Cancellation Mechanisms. 5.5 Experimental Verification of DC Offset.
5.6 Waveform Shaping Before Mixing. 5.7 Design Steps for APDP-Based
Receivers. 5.8 Architectural Illustration. 5.9 Fully Monolithic Receiver
Design Using Passive APDP Cores. 5.10 Reconfigurable Multiband Subharmonic
Front-Ends. 5.11 Conclusion. 6 ACTIVE SUBHARMONIC RECEIVER DESIGNS. 6.1
Stacking of Switching Cores. 6.2 Parallel Transistor Stacks. 6.3 Extension
to Higher-Order LO Subharmonics. 6.4 Multiple Phase Signal Generation from
Oscillators. 6.5 Future Direction and Conclusion. 7 DESIGN AND INTEGRATION
OF PASSIVE COMPONENTS. 7.1 System on Package (SoP). 7.2 On-Chip Inductors.
7.3 Capacitors. 7.4 Differentially Driven Inductors. 7.5 Transformers. 7.6
On-Chip Filters. 7.7 On-Wafer Antennas. 7.8 Wafer-Level Packaging. 7.9
Conclusion. 8 DESIGN FOR INTEGRATION. 8.1 System Design Considerations. 8.2
IC Floor Plan. 8.3 Packaging Considerations. 8.4 Conclusion. 9 FUTURE
TRENDS. 9.1 CMOS Cellphones. 9.2 Multiband, Multimode Wireless Solutions.
9.3 60 GHz Subsystems in Silicon! 9.4 Interchip Communications. 9.5
Ultrawideband Communication Technology. 9.6 Diversity Techniques. 9.7
Conclusion. Index.
RECEIVER SYSTEM DESIGN. 2.1 Frequency Planning. 2.2 Link Budget Analysis.
2.3 Propagation Effects. 2.4 Interface Planning. 2.5 Conclusion. 3 REVIEW
OF RECEIVER ARCHITECTURES. 3.1 Heterodyne Receivers. 3.2 Image Reject
Receivers. 3.3 Zero IF Receivers. 3.4 Low IF Receivers. 3.5 I ssues in
Direct Conversion Receivers. 3.6 Architecture Comparison and Trade-off. 3.7
Conclusion. 4 SILICON-BASED RECEIVER DESIGN. 4.1 Receiver Architecture and
Design. 4.2 Circuit Design. 4.3 Receiver Design Steps. 4.4 Layout
Considerations. 4.5 Characterization of Receiver Front-Ends. 4.6
Measurement Results and Discussions. 4.7 Conclusion. 5 SUBHARMONIC RECEIVER
DESIGNS. 5.1 Illustration of Subharmonic Techniques. 5.2 Mixing Using
Antisymmetric I-V Characteristics. 5.3 Impact of Mismatch Effects. 5.4 DC
Offset Cancellation Mechanisms. 5.5 Experimental Verification of DC Offset.
5.6 Waveform Shaping Before Mixing. 5.7 Design Steps for APDP-Based
Receivers. 5.8 Architectural Illustration. 5.9 Fully Monolithic Receiver
Design Using Passive APDP Cores. 5.10 Reconfigurable Multiband Subharmonic
Front-Ends. 5.11 Conclusion. 6 ACTIVE SUBHARMONIC RECEIVER DESIGNS. 6.1
Stacking of Switching Cores. 6.2 Parallel Transistor Stacks. 6.3 Extension
to Higher-Order LO Subharmonics. 6.4 Multiple Phase Signal Generation from
Oscillators. 6.5 Future Direction and Conclusion. 7 DESIGN AND INTEGRATION
OF PASSIVE COMPONENTS. 7.1 System on Package (SoP). 7.2 On-Chip Inductors.
7.3 Capacitors. 7.4 Differentially Driven Inductors. 7.5 Transformers. 7.6
On-Chip Filters. 7.7 On-Wafer Antennas. 7.8 Wafer-Level Packaging. 7.9
Conclusion. 8 DESIGN FOR INTEGRATION. 8.1 System Design Considerations. 8.2
IC Floor Plan. 8.3 Packaging Considerations. 8.4 Conclusion. 9 FUTURE
TRENDS. 9.1 CMOS Cellphones. 9.2 Multiband, Multimode Wireless Solutions.
9.3 60 GHz Subsystems in Silicon! 9.4 Interchip Communications. 9.5
Ultrawideband Communication Technology. 9.6 Diversity Techniques. 9.7
Conclusion. Index.
Preface. Acknowledgments. 1 INTRODUCTION. 1.1 Current State of the Art. 2
RECEIVER SYSTEM DESIGN. 2.1 Frequency Planning. 2.2 Link Budget Analysis.
2.3 Propagation Effects. 2.4 Interface Planning. 2.5 Conclusion. 3 REVIEW
OF RECEIVER ARCHITECTURES. 3.1 Heterodyne Receivers. 3.2 Image Reject
Receivers. 3.3 Zero IF Receivers. 3.4 Low IF Receivers. 3.5 I ssues in
Direct Conversion Receivers. 3.6 Architecture Comparison and Trade-off. 3.7
Conclusion. 4 SILICON-BASED RECEIVER DESIGN. 4.1 Receiver Architecture and
Design. 4.2 Circuit Design. 4.3 Receiver Design Steps. 4.4 Layout
Considerations. 4.5 Characterization of Receiver Front-Ends. 4.6
Measurement Results and Discussions. 4.7 Conclusion. 5 SUBHARMONIC RECEIVER
DESIGNS. 5.1 Illustration of Subharmonic Techniques. 5.2 Mixing Using
Antisymmetric I-V Characteristics. 5.3 Impact of Mismatch Effects. 5.4 DC
Offset Cancellation Mechanisms. 5.5 Experimental Verification of DC Offset.
5.6 Waveform Shaping Before Mixing. 5.7 Design Steps for APDP-Based
Receivers. 5.8 Architectural Illustration. 5.9 Fully Monolithic Receiver
Design Using Passive APDP Cores. 5.10 Reconfigurable Multiband Subharmonic
Front-Ends. 5.11 Conclusion. 6 ACTIVE SUBHARMONIC RECEIVER DESIGNS. 6.1
Stacking of Switching Cores. 6.2 Parallel Transistor Stacks. 6.3 Extension
to Higher-Order LO Subharmonics. 6.4 Multiple Phase Signal Generation from
Oscillators. 6.5 Future Direction and Conclusion. 7 DESIGN AND INTEGRATION
OF PASSIVE COMPONENTS. 7.1 System on Package (SoP). 7.2 On-Chip Inductors.
7.3 Capacitors. 7.4 Differentially Driven Inductors. 7.5 Transformers. 7.6
On-Chip Filters. 7.7 On-Wafer Antennas. 7.8 Wafer-Level Packaging. 7.9
Conclusion. 8 DESIGN FOR INTEGRATION. 8.1 System Design Considerations. 8.2
IC Floor Plan. 8.3 Packaging Considerations. 8.4 Conclusion. 9 FUTURE
TRENDS. 9.1 CMOS Cellphones. 9.2 Multiband, Multimode Wireless Solutions.
9.3 60 GHz Subsystems in Silicon! 9.4 Interchip Communications. 9.5
Ultrawideband Communication Technology. 9.6 Diversity Techniques. 9.7
Conclusion. Index.
RECEIVER SYSTEM DESIGN. 2.1 Frequency Planning. 2.2 Link Budget Analysis.
2.3 Propagation Effects. 2.4 Interface Planning. 2.5 Conclusion. 3 REVIEW
OF RECEIVER ARCHITECTURES. 3.1 Heterodyne Receivers. 3.2 Image Reject
Receivers. 3.3 Zero IF Receivers. 3.4 Low IF Receivers. 3.5 I ssues in
Direct Conversion Receivers. 3.6 Architecture Comparison and Trade-off. 3.7
Conclusion. 4 SILICON-BASED RECEIVER DESIGN. 4.1 Receiver Architecture and
Design. 4.2 Circuit Design. 4.3 Receiver Design Steps. 4.4 Layout
Considerations. 4.5 Characterization of Receiver Front-Ends. 4.6
Measurement Results and Discussions. 4.7 Conclusion. 5 SUBHARMONIC RECEIVER
DESIGNS. 5.1 Illustration of Subharmonic Techniques. 5.2 Mixing Using
Antisymmetric I-V Characteristics. 5.3 Impact of Mismatch Effects. 5.4 DC
Offset Cancellation Mechanisms. 5.5 Experimental Verification of DC Offset.
5.6 Waveform Shaping Before Mixing. 5.7 Design Steps for APDP-Based
Receivers. 5.8 Architectural Illustration. 5.9 Fully Monolithic Receiver
Design Using Passive APDP Cores. 5.10 Reconfigurable Multiband Subharmonic
Front-Ends. 5.11 Conclusion. 6 ACTIVE SUBHARMONIC RECEIVER DESIGNS. 6.1
Stacking of Switching Cores. 6.2 Parallel Transistor Stacks. 6.3 Extension
to Higher-Order LO Subharmonics. 6.4 Multiple Phase Signal Generation from
Oscillators. 6.5 Future Direction and Conclusion. 7 DESIGN AND INTEGRATION
OF PASSIVE COMPONENTS. 7.1 System on Package (SoP). 7.2 On-Chip Inductors.
7.3 Capacitors. 7.4 Differentially Driven Inductors. 7.5 Transformers. 7.6
On-Chip Filters. 7.7 On-Wafer Antennas. 7.8 Wafer-Level Packaging. 7.9
Conclusion. 8 DESIGN FOR INTEGRATION. 8.1 System Design Considerations. 8.2
IC Floor Plan. 8.3 Packaging Considerations. 8.4 Conclusion. 9 FUTURE
TRENDS. 9.1 CMOS Cellphones. 9.2 Multiband, Multimode Wireless Solutions.
9.3 60 GHz Subsystems in Silicon! 9.4 Interchip Communications. 9.5
Ultrawideband Communication Technology. 9.6 Diversity Techniques. 9.7
Conclusion. Index.