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With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: * Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM),…mehr
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- Produktdetails
- Verlag: John Wiley & Sons
- Seitenzahl: 328
- Erscheinungstermin: 14. Oktober 2016
- Englisch
- ISBN-13: 9781118707159
- Artikelnr.: 46882797
- Verlag: John Wiley & Sons
- Seitenzahl: 328
- Erscheinungstermin: 14. Oktober 2016
- Englisch
- ISBN-13: 9781118707159
- Artikelnr.: 46882797
1.1 Testing for ESD, EMI, EOS, EMC, and Latchup 1 1.2 Component and System
Level Testing 1 1.3 Qualification Testing 2 1.4 ESD Standards 3 1.5
Component Level Standards 6 1.6 System Level Standards 7 1.7 Factory and
Material Standards 7 1.8 Characterization Testing 8 1.9 ESD Library
Characterization and Qualification 12 1.10 ESD Component Standards and Chip
Architectures 12 1.11 System Level Characterization 13 1.12 Summary and
Closing Comments 13 Problems 14 References 15 2 Human Body Model 17 2.1
History 17 2.2 Scope 18 2.3 Purpose 18 2.4 Pulse Waveform 18 2.5 Equivalent
Circuit 19 2.6 Test Equipment 20 2.7 Test Sequence and Procedure 23 2.8
Failure Mechanisms 25 2.9 HBM ESD Current Paths 26 2.10 HBM ESD Protection
Circuit Solutions 28 2.11 Alternate Test Methods 32 2.12 HBM Two-Pin Stress
34 2.13 HBM Small Step Stress 37 2.14 Summary and Closing Comments 38
Problems 39 References 39 3 Machine Model 43 3.1 History 43 3.2 Scope 43
3.3 Purpose 43 3.4 Pulse Waveform 44 3.5 Equivalent Circuit 45 3.6 Test
Equipment 45 3.7 Test Sequence and Procedure 47 3.8 Failure Mechanisms 49
3.9 MM ESD Current Paths 49 3.10 MM ESD Protection Circuit Solutions 52
3.11 Alternate Test Methods 55 3.12 Machine Model to Human Body Model Ratio
57 3.13 Machine Model Status as an ESD Standard 58 3.14 Summary and Closing
Comments 58 Problems 59 References 59 4 Charged Device Model (CDM) 61 4.1
History 61 4.2 Scope 61 4.3 Purpose 62 4.4 Pulse Waveform 62 4.5 Equivalent
Circuit 65 4.6 Test Equipment 65 4.7 Test Sequence and Procedure 67 4.8
Failure Mechanisms 69 4.9 CDM ESD Current Paths 70 4.10 CDM ESD Protection
Circuit Solutions 72 4.11 Alternative Test Methods 74 4.12 Charged Board
Model (CBM) 75 4.13 Summary and Closing Comments 77 Problems 79 References
80 5 Transmission Line Pulse (TLP) Testing 84 5.1 History 84 5.2 Scope 85
5.3 Purpose 85 5.4 Pulse Waveform 86 5.5 Equivalent Circuit 87 5.6 Test
Equipment 88 5.7 Test Sequence and Procedure 95 5.8 TLP Pulsed I-V
Characteristic 98 5.9 Alternate Methods 101 5.10 TLP-to-HBM Ratio 104 5.11
Summary and Closing Comments 104 Problems 104 References 105 6 Very Fast
Transmission Line Pulse (VF-TLP) Testing 108 6.1 History 108 6.2 Scope 108
6.3 Purpose 108 6.4 Pulse Waveform 109 6.5 Equivalent Circuit 111 6.6 Test
Equipment Configuration 111 6.7 Test Sequence and Procedure 117 6.8 VF-TLP
Pulsed I-V Characteristics 121 6.9 Alternate Test Methods 124 6.10 Summary
and Closing Comments 125 Problems 128 References 128 7 IEC 61000-4-2 130
7.1 History 130 7.2 Scope 130 7.3 Purpose 130 7.4 Pulse Waveform 131 7.5
Equivalent Circuit 133 7.6 Test Equipment 133 7.7 Test Sequence and
Procedure 135 7.8 Failure Mechanisms 137 7.9 IEC 61000-4-2 ESD Current
Paths 138 7.10 ESD Protection Circuitry Solutions 139 7.11 Alternative Test
Methods 140 7.12 Summary and Closing Comments 143 Problems 143 References
144 8 Human Metal Model (HMM) 147 8.1 History 147 8.2 Scope 147 8.3 Purpose
148 8.4 Pulse Waveform 148 8.5 Equivalent Circuit 149 8.6 Test Equipment
149 8.7 Test Configuration 150 8.8 Test Sequence and Procedure 153 8.9
Failure Mechanisms 157 8.10 ESD Current Paths 158 8.11 ESD Protection
Circuit Solutions 158 8.12 Summary and Closing Comments 160 Problems 160
References 161 9 IEC 61000-4-5 163 9.1 History 163 9.2 Scope 164 9.3
Purpose 164 9.4 Pulse Waveform 165 9.5 Equivalent Circuit 166 9.6 Test
Equipment 166 9.7 Test Sequence and Procedure 168 9.8 Failure Mechanisms
168 9.9 IEC 61000-4-5 ESD Current Paths 170 9.10 ESD Protection Circuit
Solutions 170 9.11 Alternate Test Methods 171 9.12 Summary and Closing
Comments 171 Problems 172 References 172 10 Cable Discharge Event (CDE) 174
10.1 History 174 10.2 Scope 175 10.3 Purpose 175 10.4 Cable Discharge Event
- Charging, Discharging, and Pulse Waveform 175 10.5 Equivalent Circuit 178
10.6 Test Equipment 179 10.7 Test Measurement 180 10.8 Test Procedure 185
10.9 Measurement of a Cable in Different Conditions 185 10.10 Transient
Field Measurements 195 10.11 Telecommunication Cable Discharge Test System
195 10.12 Cable Discharge Current Paths 200 10.13 Failure Mechanisms 200
10.14 Cable Discharge Event (CDE) Protection 201 10.15 Alternative Test
Methods 203 10.16 Summary and Closing Comments 204 Problems 204 References
204 11 Latchup 206 11.1 History 206 11.2 Purpose 208 11.3 Scope 209 11.4
Pulse Waveform 209 11.5 Equivalent Circuit 209 11.6 Test Equipment 209 11.7
Test Sequence and Procedure 211 11.8 Failure Mechanisms 215 11.9 Latchup
Current Paths 216 11.10 Latchup Protection Solutions 216 11.11 Alternate
Test Methods 222 11.12 Single Event Latchup (SEL) Test Methods 224 11.13
Summary and Closing Comments 224 Problems 227 References 227 12 Electrical
Overstress (EOS) 230 12.1 History 230 12.2 Scope 232 12.3 Purpose 233 12.4
Pulse Waveform 233 12.5 Equivalent Circuit 233 12.6 Test Equipment 234 12.7
Test Procedure and Sequence 234 12.8 Failure Mechanisms 236 12.9 Electrical
Overstress (EOS) Protection Circuit Solutions 240 12.10 Electrical
Overstress (EOS) Testing - TLP Method and EOS 249 12.11 Electrical
Overstress (EOS) Testing - DC and Transient Latchup Testing 252 12.12
Summary and Closing Comments 252 Problems 252 References 253 13
Electromagnetic Compatibility (EMC) 257 13.1 History 257 13.2 Purpose 258
13.3 Scope 258 13.4 Pulse Waveform 258 13.5 Equivalent Circuit 259 13.6
Test Equipment 259 13.7 Test Procedures 261 13.8 Failure Mechanisms 261
13.9 ESD/EMC Current Paths 263 13.10 EMC Solutions 264 13.11 Alternative
Test Methods 266 13.12 EMC/ESD Product Evaluation - IC Prequalification 267
13.13 EMC/ESD Scanning Detection - Upset Evaluation 267 13.14 EMC/ESD
Product Qualification Process 268 13.15 Alternative ESD/EMC Scanning
Methods 271 13.16 Current Reconstruction Methodology 276 13.17 Printed
Circuit Board (PCB) Design EMC Solutions 277 13.18 Summary and Closing
Comments 280 Problems 281 References 282 A Glossary of Terms 284 B
Standards 288 B.1 ESD Association 288 B.2 International Organization of
Standards 289 B.3 IEC 289 B.4 RTCA 289 B.5 Department of Defense 289 B.6
Military Standards 289 B.7 Airborne Standards and Lightning 290 Index 291
1.1 Testing for ESD, EMI, EOS, EMC, and Latchup 1 1.2 Component and System
Level Testing 1 1.3 Qualification Testing 2 1.4 ESD Standards 3 1.5
Component Level Standards 6 1.6 System Level Standards 7 1.7 Factory and
Material Standards 7 1.8 Characterization Testing 8 1.9 ESD Library
Characterization and Qualification 12 1.10 ESD Component Standards and Chip
Architectures 12 1.11 System Level Characterization 13 1.12 Summary and
Closing Comments 13 Problems 14 References 15 2 Human Body Model 17 2.1
History 17 2.2 Scope 18 2.3 Purpose 18 2.4 Pulse Waveform 18 2.5 Equivalent
Circuit 19 2.6 Test Equipment 20 2.7 Test Sequence and Procedure 23 2.8
Failure Mechanisms 25 2.9 HBM ESD Current Paths 26 2.10 HBM ESD Protection
Circuit Solutions 28 2.11 Alternate Test Methods 32 2.12 HBM Two-Pin Stress
34 2.13 HBM Small Step Stress 37 2.14 Summary and Closing Comments 38
Problems 39 References 39 3 Machine Model 43 3.1 History 43 3.2 Scope 43
3.3 Purpose 43 3.4 Pulse Waveform 44 3.5 Equivalent Circuit 45 3.6 Test
Equipment 45 3.7 Test Sequence and Procedure 47 3.8 Failure Mechanisms 49
3.9 MM ESD Current Paths 49 3.10 MM ESD Protection Circuit Solutions 52
3.11 Alternate Test Methods 55 3.12 Machine Model to Human Body Model Ratio
57 3.13 Machine Model Status as an ESD Standard 58 3.14 Summary and Closing
Comments 58 Problems 59 References 59 4 Charged Device Model (CDM) 61 4.1
History 61 4.2 Scope 61 4.3 Purpose 62 4.4 Pulse Waveform 62 4.5 Equivalent
Circuit 65 4.6 Test Equipment 65 4.7 Test Sequence and Procedure 67 4.8
Failure Mechanisms 69 4.9 CDM ESD Current Paths 70 4.10 CDM ESD Protection
Circuit Solutions 72 4.11 Alternative Test Methods 74 4.12 Charged Board
Model (CBM) 75 4.13 Summary and Closing Comments 77 Problems 79 References
80 5 Transmission Line Pulse (TLP) Testing 84 5.1 History 84 5.2 Scope 85
5.3 Purpose 85 5.4 Pulse Waveform 86 5.5 Equivalent Circuit 87 5.6 Test
Equipment 88 5.7 Test Sequence and Procedure 95 5.8 TLP Pulsed I-V
Characteristic 98 5.9 Alternate Methods 101 5.10 TLP-to-HBM Ratio 104 5.11
Summary and Closing Comments 104 Problems 104 References 105 6 Very Fast
Transmission Line Pulse (VF-TLP) Testing 108 6.1 History 108 6.2 Scope 108
6.3 Purpose 108 6.4 Pulse Waveform 109 6.5 Equivalent Circuit 111 6.6 Test
Equipment Configuration 111 6.7 Test Sequence and Procedure 117 6.8 VF-TLP
Pulsed I-V Characteristics 121 6.9 Alternate Test Methods 124 6.10 Summary
and Closing Comments 125 Problems 128 References 128 7 IEC 61000-4-2 130
7.1 History 130 7.2 Scope 130 7.3 Purpose 130 7.4 Pulse Waveform 131 7.5
Equivalent Circuit 133 7.6 Test Equipment 133 7.7 Test Sequence and
Procedure 135 7.8 Failure Mechanisms 137 7.9 IEC 61000-4-2 ESD Current
Paths 138 7.10 ESD Protection Circuitry Solutions 139 7.11 Alternative Test
Methods 140 7.12 Summary and Closing Comments 143 Problems 143 References
144 8 Human Metal Model (HMM) 147 8.1 History 147 8.2 Scope 147 8.3 Purpose
148 8.4 Pulse Waveform 148 8.5 Equivalent Circuit 149 8.6 Test Equipment
149 8.7 Test Configuration 150 8.8 Test Sequence and Procedure 153 8.9
Failure Mechanisms 157 8.10 ESD Current Paths 158 8.11 ESD Protection
Circuit Solutions 158 8.12 Summary and Closing Comments 160 Problems 160
References 161 9 IEC 61000-4-5 163 9.1 History 163 9.2 Scope 164 9.3
Purpose 164 9.4 Pulse Waveform 165 9.5 Equivalent Circuit 166 9.6 Test
Equipment 166 9.7 Test Sequence and Procedure 168 9.8 Failure Mechanisms
168 9.9 IEC 61000-4-5 ESD Current Paths 170 9.10 ESD Protection Circuit
Solutions 170 9.11 Alternate Test Methods 171 9.12 Summary and Closing
Comments 171 Problems 172 References 172 10 Cable Discharge Event (CDE) 174
10.1 History 174 10.2 Scope 175 10.3 Purpose 175 10.4 Cable Discharge Event
- Charging, Discharging, and Pulse Waveform 175 10.5 Equivalent Circuit 178
10.6 Test Equipment 179 10.7 Test Measurement 180 10.8 Test Procedure 185
10.9 Measurement of a Cable in Different Conditions 185 10.10 Transient
Field Measurements 195 10.11 Telecommunication Cable Discharge Test System
195 10.12 Cable Discharge Current Paths 200 10.13 Failure Mechanisms 200
10.14 Cable Discharge Event (CDE) Protection 201 10.15 Alternative Test
Methods 203 10.16 Summary and Closing Comments 204 Problems 204 References
204 11 Latchup 206 11.1 History 206 11.2 Purpose 208 11.3 Scope 209 11.4
Pulse Waveform 209 11.5 Equivalent Circuit 209 11.6 Test Equipment 209 11.7
Test Sequence and Procedure 211 11.8 Failure Mechanisms 215 11.9 Latchup
Current Paths 216 11.10 Latchup Protection Solutions 216 11.11 Alternate
Test Methods 222 11.12 Single Event Latchup (SEL) Test Methods 224 11.13
Summary and Closing Comments 224 Problems 227 References 227 12 Electrical
Overstress (EOS) 230 12.1 History 230 12.2 Scope 232 12.3 Purpose 233 12.4
Pulse Waveform 233 12.5 Equivalent Circuit 233 12.6 Test Equipment 234 12.7
Test Procedure and Sequence 234 12.8 Failure Mechanisms 236 12.9 Electrical
Overstress (EOS) Protection Circuit Solutions 240 12.10 Electrical
Overstress (EOS) Testing - TLP Method and EOS 249 12.11 Electrical
Overstress (EOS) Testing - DC and Transient Latchup Testing 252 12.12
Summary and Closing Comments 252 Problems 252 References 253 13
Electromagnetic Compatibility (EMC) 257 13.1 History 257 13.2 Purpose 258
13.3 Scope 258 13.4 Pulse Waveform 258 13.5 Equivalent Circuit 259 13.6
Test Equipment 259 13.7 Test Procedures 261 13.8 Failure Mechanisms 261
13.9 ESD/EMC Current Paths 263 13.10 EMC Solutions 264 13.11 Alternative
Test Methods 266 13.12 EMC/ESD Product Evaluation - IC Prequalification 267
13.13 EMC/ESD Scanning Detection - Upset Evaluation 267 13.14 EMC/ESD
Product Qualification Process 268 13.15 Alternative ESD/EMC Scanning
Methods 271 13.16 Current Reconstruction Methodology 276 13.17 Printed
Circuit Board (PCB) Design EMC Solutions 277 13.18 Summary and Closing
Comments 280 Problems 281 References 282 A Glossary of Terms 284 B
Standards 288 B.1 ESD Association 288 B.2 International Organization of
Standards 289 B.3 IEC 289 B.4 RTCA 289 B.5 Department of Defense 289 B.6
Military Standards 289 B.7 Airborne Standards and Lightning 290 Index 291