Mourad Elsobky, Joachim N. Burghartz

Hybrid Systems-in-Foil

• Broschiertes Buch

Produktbeschreibung

An introduction to the Hybrid Systems-in-Foil (HySiF) concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided, several bendable electronic components are presented demonstrating the benefits of HySiF, and prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.

Produktdetails

• Verlag: Cambridge University Press
• Seitenzahl: 92
• Erscheinungstermin: 6. Oktober 2021
• Englisch
• Abmessung: 229mm x 152mm x 5mm
• Gewicht: 148g
• ISBN-13: 9781108984744
• ISBN-10: 1108984746
• Artikelnr.: 62354807

Inhaltsangabe

1. Flexible Electronics and Hybrid Systems
in
Foil; 2. Ultra
Thin Chip Fabrication and Flexible Packaging Technologies; 3. On
Foil Passive and Active Components; 4. Ultra
Thin Chip Characterization; 5. Hybrid Systems
in
Foil Demonstrators; Abbreviations; References.