Gebundenes Buch

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

High Performance Compute and System-In-Package

Herausgegeben: Keser, Beth; Kröhnert, Steffen
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Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologiesIn Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches.The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced applicatio...