Advanced Electronic Packaging - Brown, William D.; Ulrich, Richard K.
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This updated edition of the widely adopted industry classic Advanced Electronic Packaging, Second Edition now features a new focus on the current practices in electronic packaging. Since electronic packaging is a constantly and rapidly changing field, there is a continuing need to educate students, not only on the fundamentals of packaging, but also on current and future technologies. Much of the material contained in the first edition of the book, primarily the background material, has been transferred directly to the second edition.
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Produktbeschreibung
This updated edition of the widely adopted industry classic Advanced Electronic Packaging, Second Edition now features a new focus on the current practices in electronic packaging. Since electronic packaging is a constantly and rapidly changing field, there is a continuing need to educate students, not only on the fundamentals of packaging, but also on current and future technologies. Much of the material contained in the first edition of the book, primarily the background material, has been transferred directly to the second edition.
Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.

Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:
_ Packaging materials and applications
_ Modeling and simulations
_ Analytical techniques for materials
_ MEMS packaging
_ Fabrication technologies and package design
_ Reliability
_ Electrical,mechanical, and thermal considerations
_ Three-dimensional packaging

All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.

Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.
Autorenporträt
WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.
Rezensionen
"...offers a broad perspective on electronic packaging." - Advanced Packaging Online, August 11, 2006

"...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off." - Chip Scale Review, July 2006

"...useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies." - CircuiTree, May 1, 2006
"...a very nice reference." (IEEE Circuits & Devices Magazine, November/December 2006)

"...offers a broad perspective on electronic packaging." (Advanced Packaging Online, August 11, 2006)

"...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off." (Chip Scale Review, July 2006)

"...useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies." (CircuiTree, May 1, 2006)