This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
_ Describes the processes available for creating integrated passives, measuring their properties, and applying them.
_ Brings reader up to date in a fast-moving technology.
_ Enables reader to implement the technology into a manufacturing environment.
_ Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
_ Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
_ Describes the processes available for creating integrated passives, measuring their properties, and applying them.
_ Brings reader up to date in a fast-moving technology.
_ Enables reader to implement the technology into a manufacturing environment.
_ Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
_ Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)
"...a comprehensive look at the reasons and current challenges...[of integrating] passive devices into board or IC...just the right dose of the math to explain the physics and theory behind the technology." (IEEE Circuits & Devices Magazine, Jan/Feb 2005)
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)