Structural Dynamics of Electronic and Photonic Systems (eBook, PDF)
Redaktion: Suhir, Ephraim; Steinberg, David S.; Yu, T. X.
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Structural Dynamics of Electronic and Photonic Systems (eBook, PDF)
Redaktion: Suhir, Ephraim; Steinberg, David S.; Yu, T. X.
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The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted…mehr
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- Größe: 11.82MB
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- Produktdetails
- Verlag: John Wiley & Sons
- Seitenzahl: 608
- Erscheinungstermin: 1. April 2011
- Englisch
- ISBN-13: 9780470886786
- Artikelnr.: 37300074
- Verlag: John Wiley & Sons
- Seitenzahl: 608
- Erscheinungstermin: 1. April 2011
- Englisch
- ISBN-13: 9780470886786
- Artikelnr.: 37300074
Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic
Stability of These Systems (David S. Steinberg). 2 Linear Response to
Shocks and Vibrations (Ephraim Suhir). 3 Linear and Nonlinear Vibrations
Caused by Periodic Impulses (Ephraim Suhir). 4 Random Vibrations of
Structural Elements in Electronic and Photonic Systems (Ephraim Suhir). 5
Natural Frequencies and Failure Mechanisms of Electronic and Photonic
Structures Subjected to Sinusoidal or Random Vibrations (David S.
Steinberg). 6 Drop/Impact of Typical Portable Electronic Devices:
Experimentation and Modeling (T. X. Yu and C. Y. Zhou). 7 Shock Test
Methods and Test Standards for Portable Electronic Devices (C. Y. Zhou, T.
X. Yu, S. W. Ricky Lee, and Ephraim Suhir). 8 Dynamic Response of Solder
Joint Interconnections to Vibration and Shock (David S. Steinberg). 9 Test
Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating
Electronic Equipment (David S. Steinberg). 10 Correlation between
Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical
Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy (Fubin
Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark). 11
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free
Solders in Electronic Packaging (V. B. C. Tan, K. C. Ong, C. T. Lim, and J.
E. Field). 12 Fatigue Damage Evaluation for Microelectronic Components
Subjected to Vibration (T. E. Wong). 13 Vibration Considerations for
Sensitive Research and Production Facilities (E. E. Ungar, H. Amick, and J.
A. Zapfe). 14 Applications of Finite Element Analysis: Attributes and
Challenges (Metin Ozen). 15 Shock Simulation of Drop Test of Hard Disk
Drives (D. W. Shu, B. J. Shi, and J. Luo). 16 Shock Protection of Portable
Electronic Devices Using a "Cushion" of an Array of Wires (AOW) (Ephraim
Suhir). 17 Board-Level Reliability of Lead-Free Solder under Mechanical
Shock and Vibration Loads (Toni T. Matilla, Pekka Marjamaki, and Jorma
Kivilahti). 18 Dynamic Response of PCB Structures to Shock Loading in
Reliability Tests (Milena Vujosevic and Ephraim Suhir). 19 Linear Response
of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests
Adequately Mimic Drop Test Conditions? (Ephraim Suhir). 20 Shock Isolation
of Micromachined Device for High-g Applications (Sang-Hee Yoon, Jin-Eep
Roh, and Ki Lyug Kim). 21 Reliability Assessment of Microelectronics
Packages Using Dynamic Testing Methods (X. Q. Shi, G. Y. Li, and Q. J.
Yang). 22 Thermal Cycle and Vibration/Drop Reliability of Area Array
Package Assemblies (Reza Ghaffarian). 23 Could an Impact Load of Finite
Duration Be Substituted with an Instantaneous Impulse? (Ephraim Suhir and
Luciano Arruda). Index.
Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic
Stability of These Systems (David S. Steinberg). 2 Linear Response to
Shocks and Vibrations (Ephraim Suhir). 3 Linear and Nonlinear Vibrations
Caused by Periodic Impulses (Ephraim Suhir). 4 Random Vibrations of
Structural Elements in Electronic and Photonic Systems (Ephraim Suhir). 5
Natural Frequencies and Failure Mechanisms of Electronic and Photonic
Structures Subjected to Sinusoidal or Random Vibrations (David S.
Steinberg). 6 Drop/Impact of Typical Portable Electronic Devices:
Experimentation and Modeling (T. X. Yu and C. Y. Zhou). 7 Shock Test
Methods and Test Standards for Portable Electronic Devices (C. Y. Zhou, T.
X. Yu, S. W. Ricky Lee, and Ephraim Suhir). 8 Dynamic Response of Solder
Joint Interconnections to Vibration and Shock (David S. Steinberg). 9 Test
Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating
Electronic Equipment (David S. Steinberg). 10 Correlation between
Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical
Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy (Fubin
Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark). 11
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free
Solders in Electronic Packaging (V. B. C. Tan, K. C. Ong, C. T. Lim, and J.
E. Field). 12 Fatigue Damage Evaluation for Microelectronic Components
Subjected to Vibration (T. E. Wong). 13 Vibration Considerations for
Sensitive Research and Production Facilities (E. E. Ungar, H. Amick, and J.
A. Zapfe). 14 Applications of Finite Element Analysis: Attributes and
Challenges (Metin Ozen). 15 Shock Simulation of Drop Test of Hard Disk
Drives (D. W. Shu, B. J. Shi, and J. Luo). 16 Shock Protection of Portable
Electronic Devices Using a "Cushion" of an Array of Wires (AOW) (Ephraim
Suhir). 17 Board-Level Reliability of Lead-Free Solder under Mechanical
Shock and Vibration Loads (Toni T. Matilla, Pekka Marjamaki, and Jorma
Kivilahti). 18 Dynamic Response of PCB Structures to Shock Loading in
Reliability Tests (Milena Vujosevic and Ephraim Suhir). 19 Linear Response
of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests
Adequately Mimic Drop Test Conditions? (Ephraim Suhir). 20 Shock Isolation
of Micromachined Device for High-g Applications (Sang-Hee Yoon, Jin-Eep
Roh, and Ki Lyug Kim). 21 Reliability Assessment of Microelectronics
Packages Using Dynamic Testing Methods (X. Q. Shi, G. Y. Li, and Q. J.
Yang). 22 Thermal Cycle and Vibration/Drop Reliability of Area Array
Package Assemblies (Reza Ghaffarian). 23 Could an Impact Load of Finite
Duration Be Substituted with an Instantaneous Impulse? (Ephraim Suhir and
Luciano Arruda). Index.