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  • Format: PDF

Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides…mehr

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  • Größe: 145.39MB
Produktbeschreibung
Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.

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Autorenporträt
Eugene R. Hnatek is Senior Director of Quality, Qualcomm Incorporated, San Diego, California. The author of 12 books, including Integrated Circuit Quality and Reliability, Second Edition, Revised and Expanded (Marcel Dekker, Inc.), and the author or coauthor of more than 250 professional publications, Mr. Hnatek is a member of the Institute of Environmental Sciences and Technology, the Electrostatic Discharge Association and the American Society for Quality. He received the B.S.E.E. and M.S.E.E. degrees from Bradley University, Peoria, Illinois.