Duixian Liu, Yueping Zhang

Antenna-in-Package Technology and Applications (eBook, ePUB)

• Format: ePub

Produktbeschreibung

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors--well-known experts on the topic--explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit-based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: * Includes a brief history of antenna-in-package technology * Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) * Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

---

Dieser Download kann aus rechtlichen Gründen nur mit Rechnungsadresse in A, B, BG, CY, CZ, D, DK, EW, E, FIN, F, GR, HR, H, IRL, I, LT, L, LR, M, NL, PL, P, R, S, SLO, SK ausgeliefert werden.

Produktdetails

• Verlag: John Wiley & Sons
• Seitenzahl: 416
• Erscheinungstermin: 3. März 2020
• Englisch
• ISBN-13: 9781119556657
• Artikelnr.: 58820257

Autorenporträt

DUIXIAN LIU, PHD, is a researcher and master inventor at IBM at Thomas J. Watson Research Center. He is a co-editor of the Wiley title Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits and Springer title Handbook of Antenna Technologies. He served as an Associate Editor of the IEEE Transactions on Antennas and Propagation for nine years and a Guest Editor for the IEEE Transactions on Antennas and Propagation onfour Special Issues related to mm-wave antenna designs. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE. YUEPING ZHANG, PhD, is a Professor of Electronic Engineering at Nanyang Technological University and a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE AP-S). He served as an Associate Editor of the IEEE Transactions on Antennas and Propagation. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE.

Inhaltsangabe

List of Contributors xiii

Preface xv

Abbreviations xix

1 Introduction 1
Yueping Zhang

1.1 Background 1

1.2 The Idea 3

1.3 Exploring the Idea 4

1.3.1 Bluetooth Radio and Other RF Applications 4

1.3.2 60-GHz Radio and Other Millimeter-wave Applications 7

1.4 Developing the Idea into a Mainstream Technology 8

1.5 Concluding Remarks 11

Acknowledgements 12

References 12

2 Antennas 17
Yueping Zhang

2.1 Introduction 17

2.2 Basic Antennas 17

2.2.1 Dipole 17

2.2.2 Monopole 18

2.2.3 Loop 18

2.2.4 Slot 19

2.3 Unusual Antennas 19

2.3.1 Laminated Resonator Antenna 19

2.3.2 Dish-like Reflector Antenna 19

2.3.3 Slab Waveguide Antenna 20

2.3.4 Differentially Fed Aperture Antenna 20

2.3.5 Step-profiled Corrugated Horn Antenna 21

2.4 Microstrip Patch Antennas 21

2.4.1 Basic Patch Antennas 21

2.4.2 Stacked Patch Antennas 25

2.4.3 Patch Antenna Arrays 27

2.5 Microstrip Grid Array Antennas 30

2.5.1 Basic Configuration 31

2.5.2 Principle of Operation 31

2.5.3 Design Formulas with an Example 32

2.6 Yagi-Uda Antennas 37

2.6.1 Horizontal Yagi-Uda Antenna 38

2.6.2 Vertical Yagi-Uda Antenna 38

2.6.3 Yagi-Uda Antenna Array 39

2.7 Magneto-Electric Dipole Antennas 41

2.7.1 Single-polarized Microstrip Magneto-electric Dipole Antenna 42

2.7.2 Dual-polarized Microstrip Magneto-electric Dipole Antenna 42

2.7.3 Simulated and Measured Results 45

2.8 Performance Improvement Techniques 45

2.8.1 Single-layer Spiral AMC 49

2.8.2 Design Guidelines 49

2.8.3 A Design Example 50

2.9 Summary 50

Acknowledgements 50

References 51

3 Packaging Technologies 57
Ning Ye

3.1 Introduction 57

3.2 Major Packaging Milestones 57

3.3 Packaging Taxonomy 58

3.3.1 Routing Layer in Packages 58

3.3.1.1 Lead Frame 58

3.3.1.2 Laminate 59

3.3.1.3 Redistribution Layer 61

3.3.2 Die to Routing Layer Interconnect 62

3.3.2.1 Wire Bonds 62

3.3.2.2 Flip Chips 63

3.4 Packaging Process for Several Major Packages 64

3.4.1 Wire Bond Plastic Ball Grid Array 64

3.4.1.1 Die Preparation 66

3.4.1.2 Die Attach 66

3.4.1.3 Wire Bonding 67

3.4.1.4 Molding 69

3.4.1.5 Ball Mounting 71

3.4.1.6 Package Singulation 71

3.4.2 Wire Bond Quad Flat No-Lead Packages 71

3.4.3 Flip-chip Plastic Ball Grid Arrays 73

3.4.3.1 Flip-chip Bumping 73

3.4.3.2 Flip-chip Attach 75

3.4.3.3 Underfill 76

3.4.4 Wafer Level Packaging 77

3.4.5 Fan Out Wafer Level Packaging 78

3.5 Summary and Emerging Trends 79

References 84

4 Electrical, Mechanical, and Thermal Co-Design 89
Xiaoxiong Gu and Pritish Parida

4.1 Introduction 89

4.2 Electrical, Warpage, and Thermomechanical Analysis for AiP Co-design 92

4.2.1 28-GHz Phased Array Antenna Module Overview 92

4.2.2 Thermomechanical Test Vehicle Overview 94

4.2.3 Antenna Prototyping and Interconnect Characterization 96

4.2.4 Warpage Analysis and Test 96

4.2.5 Thermal Simulation and Characterization 98

4.3 Thermal Management Considerations for Next-generation Heterogeneous Integrated Systems 102
<