Betty Prince

Gebundenes Buch

Vertical 3D Memory Technologie

Beschreibung

The large scale integration and planar scaling of individualsystem chips is reaching an expensive limit. If individual chipsnow, and later terrabyte memory blocks, memory macros, andprocessing cores, can be tightly linked in optimally designed andprocessed small footprint vertical stacks, then performance can beincreased, power reduced and cost contained. This book reviews forthe electronics industry engineer, professional and student thecritical areas of development for 3D vertical memory chipsincluding: gate-all-around and junction-less nanowire memories,stacked thin film and double gate memories, terrabit verticalchannel and vertical gate stacked NAND flash, large scale stackingof Resistance RAM cross-point arrays, and 2.5D/3D stacking ofmemory and processor chips with through-silicon-via connections now and remote links later.

Key features:

Presents a review of the status and trends in 3-dimensionalvertical memory chip technologies.
Extensively reviews advanced vertical memory chip technologyand development
Explores technology process routes and 3D chip integration in asingle reference

Autor

Dr Betty Prince has over 30 years' experience in the semiconductor industry having worked with Texas Instruments, N.V. Philips, Motorola, R.C.A., and Fairchild and is currently CEO of Memory Strategies International. She has authored four books and served from 1991-1994 on the Technical Advisory Board of IEEE Spectrum magazine. She is a Senior Life Member of the IEEE and served as an IEEE SSCS Distinguished Lecturer and on the Program Committee of the IEEE Custom Integrated Circuit conference. She was founder of the JEDEC JC-16 Interface Standards Committee and was active for many years on the JC-42 Memory Committee where she was co-chair of the SRAM standards group. She has been U.S. representative to the IEC SC47A WG3 Memory Standards Committee. Dr Prince has served on the Technical Advisory Board of several memory companies and has been on the Board of Directors of Mosaid Technologies. She holds patents in the memory, processor and interface areas and has degrees in Physics, Math, and Finance with doctoral dissertation in fractal modeling.

Produktdetails

• Verlag: Wiley & Sons
• 1. Auflage
• Seitenzahl: 368
• Erscheinungstermin: 26. September 2014
• Englisch
• Abmessung: 250mm x 175mm x 24mm
• Gewicht: 816g
• ISBN-13: 9781118760512
• ISBN-10: 1118760514
• Artikelnr.: 41372272