Thermal Management Materials for Electronic Packaging

Preparation, Characterization, and Devices
Herausgegeben:Tian, Xingyou

• Gebundenes Buch

Produktbeschreibung

Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.

Produktdetails

• Verlag: Wiley-VCH
• Artikelnr. des Verlages: 1135242 000
• 1. Auflage
• Erscheinungstermin: 17. Januar 2024
• Englisch
• Abmessung: 246mm x 171mm x 22mm
• Gewicht: 836g
• ISBN-13: 9783527352425
• ISBN-10: 3527352422
• Artikelnr.: 68363003

Autorenporträt

Professor Xingyou Tian is Deputy Director of Institute for Solid State Physics (ISSP), Hefei Institutes of Physical Science, Chinese Academy of Sciences and Director of the Key Laboratory of Photovoltaic and Energy-Saving Materials of the Chinese Academy of Sciences. His main research include key functional materials for electronic devices, integrated circuit heat dissipation materials, polymer nanocomposite materials, and new energy-saving and environmentally friendly materials.

Inhaltsangabe

OVERVIEW OF WORKS

PHYSICAL BASIS OF THERMAL CONDUCTION
Basic Concepts and Laws of Thermal Conduction
Heat Conduction Differential Equation and Finite Solution
Heat Conduction Mechanism and Theoretical Calculation
Thermal Conductivity of Solids

ELECTRONIC PACKAGING MATERIALS FOR THERMAL MANAGEMENT
Definition and Classification of Electronic Packaging
Thermal Management in Electronic Equipment
Require of Electronic Packaging Materials
Electronic Packaging Materials

CHARACTERIZATION METHODS FOR THERMAL MANAGEMENT MATERIALS
Overview of the Development of Thermal Conductivity Test Methods
Test Method Classification and Standards
Steady-State Method
Non-Steady-State Method
Electrical Properties and Measurement Techniques
Material Characterization Analysis Technology
Reliability Analysis and Environmental Performance Evaluation

CONSTRUCTION OF THERMAL CONDUCTIVITY NETWORK AND PERFORMANCE OPTIMIZATION OF POLYMER SUBSTRATE
Synthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of Substrates
Study on Polymer Thermal Conductive Composites with Oriented Structure
Preparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton Structure
Assembly of Thermal Conductive Materials in Different Dimensions and Preparation of Composite Materials
Conclusion

OPTIMAL DESIGN OF HIGH THERMAL CONDUCTIVE METAL SUBSTRATE SYSTEM FOR HIGH POWER DEVICES
Power Devices and Thermal Conduction
Optimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and Components
Formation and Evolution Rules of High Thermal Conductive Interface and its Control Method
Formation and Evolution Rules of High Thermal Conductive Composite Microstructure and its Control Method

PREPARATION AND PERFORMANCE STUDY OF SILICON NITRIDE CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY
Rapid Nitridation of Silicon Compact and Tape Casting of Silicon
Optimization of Sintering Aids for High Thermal Conductivity Si3N4 Ceramics
Investigation of Cu-Metalized Si3N4 Substrates via Active Metal Brazing (AMB) Method

PREPARATION AND PROPERTIES OF THERMAL INTERFACE MATERIALS
Conception of Thermal Interface Materials
Polymer Based Thermal Interface Materials
Metal Based Thermal Interface Materials
Carbon Based Thermal Interface Materials
Molecular Simulation Study of Interfacial Thermal Transfer

STUDY ON SIMULATION OF THERMAL CONDUCTIVE COMPOSITE FILLING THEORY
Molecular Simulation Algorithms for Thermal Conductivity Calculating
Molecular Simulation Study on Polymers
Molecular Simulation Study on TC of Si3N4 Ceramics
Molecular Simulation Study on TC of Diamond/Copper Composites
Simulation Study on Polymer-Based Composites

MARKET AND FUTURE PROSPECTS OF HIGH THERMAL CONDUCTIVITY COMPOSITE MATERIALS
Basic Concept of Composite Materials
Thermal Conductivity Mechanism and Thermal Conductivity Model
Composite Materials in Electronic Devices
Thermal Functional Composites
The Modification of Composite Materials
The New Packaging Material
Thermal Management of Electronic Devices
Methods for Improving Thermal Conductivity of Composite Materials
The Application of Composite Materials
Conclusions