110,99 €
inkl. MwSt.
Versandkostenfrei*
Versandfertig in 6-10 Tagen
payback
55 °P sammeln
  • Broschiertes Buch

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Test Design and Inverse Method Algorithms
Inverse Problems: Virtual Fields Method
Residual Stresses: Measurement, Uncertainty & Validation
Residual Stresses: Eigenvalues, Modeling,
…mehr

Produktbeschreibung
Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:

Test Design and Inverse Method Algorithms

Inverse Problems: Virtual Fields Method

Residual Stresses: Measurement, Uncertainty & Validation

Residual Stresses: Eigenvalues, Modeling, & Crack Growth

Material Characterizations Using Thermography
Fatigue, Damage & Fracture Evaluation Using Infrared Thermography

Autorenporträt
Antonio Baldi - University of Cagliari, Sardinia, Italy; Xavier Balandraud - Sigma Clermont Engineering School, France; Sharlotte L.B. Kramer - Sandia National Laboratories, Albuquerque, NM, USA; Fabrice Pierron - University of Southampton, Southampton, UK; John Considine - United States Forrest Service, Madison, WI, USA; Sven Bossuyt - Aalto University, Aalto, Finland; Johan Hoefnagels - Eindhoven University of Technology, Eindhoven, Netherlands.