Ulrich H. P. Fischer-Hirchert

Photonic Packaging Sourcebook

Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

• Gebundenes Buch

Produktbeschreibung

The field of packaging of photonic devices is very broad and diverse. This book is the first and only comprehensive sourcebook on photonic assembly techniques. For photonic packaging experts and professionals in corresponding technologies, it provides an overview of today's state-of-the-art technologies. From basic calculations to optimize the fiber chip coupling efficiency, the content will guide the reader to the practical use of optical connectors. Active and passive adjustment and coupling basics in combination with many examples will help the engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of actual industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Up to date simulation techniques like FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

Produktdetails

• Verlag: Springer / Springer Berlin Heidelberg / Springer, Berlin
• Artikelnr. des Verlages: 80124163, 978-3-642-25375-1
• 2015
• Seitenzahl: 348
• Erscheinungstermin: 22. April 2015
• Englisch
• Abmessung: 241mm x 160mm x 25mm
• Gewicht: 685g
• ISBN-13: 9783642253751
• ISBN-10: 364225375X
• Artikelnr.: 34230163

Autorenporträt

Prof. Dr. rer .nat. Dr.-Ing. habil Ulrich Fischer-Hirchert is CEO of HarzOptics GmbH, Wernigerode, and Professor of Communication Technics at the Harz University of Applied Sciences, Wernigerode.

Inhaltsangabe

Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.