Mckeown

Mechanical Analysis of Electronic Packaging Systems

• Gebundenes Buch

Produktbeschreibung

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Produktdetails

• Verlag: Taylor & Francis Ltd (Sales)
• Seitenzahl: 374
• Erscheinungstermin: 6. April 1999
• Englisch
• Abmessung: 232mm x 160mm x 23mm
• Gewicht: 617g
• ISBN-13: 9780824770334
• ISBN-10: 0824770331
• Artikelnr.: 21830845

Autorenporträt

Mckeown,

Inhaltsangabe

Analytical tools
thermal performance analysis
mechanical performance analysis
life analysis
other analysis
analysis of test data
reporting and verification.