Pradeep Lall, Michael G Pecht, Edward B Hakim

Influence of Temperature on Microelectronics and System Reliability

A Physics of Failure Approach

• Broschiertes Buch

Produktbeschreibung

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures.

Produktdetails

• Verlag: CRC Press
• Seitenzahl: 336
• Erscheinungstermin: 19. Juni 2019
• Englisch
• Abmessung: 251mm x 178mm x 15mm
• Gewicht: 771g
• ISBN-13: 9780367400972
• ISBN-10: 0367400979
• Artikelnr.: 57785420

Autorenporträt

Pradeep Lall, Michael G. Pecht, Edward B. Hakim

Inhaltsangabe

Chapter 1 Temperature as a Reliability Factor
Chapter 2 Temperature Dependence of Microelectronic Package Failure Mechanisms
Chapter 3 Temperature Dependence of Microelectronic Package Failure Mechanisms
Chapter 4 Electrical Parameter Variations in Bipolar Devices
Chapter 5 Electrical Parameter Variations in MOSFET Devices
Chapter 6 a Physics-of-failure Approach to IC Burn-In
Chapter 7 Derating Guidelines for Temperature-tolerant Design of Microelectronic Devices
Chapter 8 Derating Guidelines for Temperature-tolerant Design of Electronic Packages
Chapter 9 Conclusions
References
Index
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