John T. Bateson

In-Circuit Testing

• Broschiertes Buch

Produktbeschreibung

The aim of this text is to increase your understanding of the methods employed for improving the quality of printed circuit boards (PCBs) in a practical manufacturing environment, by discussing printed circuit board faults and the test strategies implemented to detect these faults. This text emphasizes in-circuit testing as a prime test and diagnostic technique. Test strategies are described - implementing functional board testers, in-circuit board testers, in-circuit analyzers, and loaded board shorts testers. Also discussed are in-circuit tester's hardware, software, fix turing, and programming. Specific attention has been given to the in-circuit tester's capabilities and limitations, features and benefits, advantages and disadvantages. Chapter 5, as part of the total production testing process, discusses rework stations, network ing, and test area management. Chapter 8 is devoted to discussing the benefits derived by employing in-circuit testing in the service repair arena. This text concludes with chapters on vendor investiga tion and a financial justification. Additional emphasis is placed on having design engineering acquire an interest in manufacturability, testability, and the importance of consulting with manufacturing early in the design process. This book is designed for ease of reading and comprehension for all levels of interest: ATE students, fust-time ATE users, as well as those involved in test, manufacturing, quality control or assurance, production, engineering, and management.

Produktdetails

• Verlag: Springer Netherlands / Springer, Berlin
• Softcover reprint of the original 1st ed. 1985
• Seitenzahl: 268
• Erscheinungstermin: 20. März 2012
• Englisch
• Abmessung: 229mm x 152mm x 15mm
• Gewicht: 408g
• ISBN-13: 9789401170116
• ISBN-10: 9401170118
• Artikelnr.: 39511000

Inhaltsangabe

1. Understanding the Production Fault Sources.- 1.1. Component Fault Sources.- 1.2. Manufacturing Fault Sources.- 1.3. Performance Fault Sources.- 1.4. Manufacturability.- 1.5. PCB Fault Spectrum.- 1.6. Defective PCB Investigation.- 1.7. Future Fault Distribution.- 2. Automatic Test Equipment for Production Test.- 2.1. In-House Test Systems.- 2.2. Commercial Testers.- 2.3. Loaded-Board Testing Trends.- 2.4. Tester's Fault Coverage.- 2.5. Fault Coverage and Test Programming.- 2.6. Test Diagnostics.- 2.7. Unverifiable Faults.- 2.8. Failures at System Test.- 2.9. Cost of Testing.- 3. Production PCB Test System Comparison.- 3.1. In-Circuit and Functional Board Tester Comparison.- 3.2. In Circuit and Functional Board Tester Summary.- 3.3. Comparison of In-Circuit Tester, In-Circuit Analyzer, and Loaded-Board Shorts Tester.- 3.4. In-Circuit Tester, In-Circuit Analyzer, and Loaded-Board Shorts Tester Summary.- 3.5. Low-Cost ATE.- 4. PCB Production Test Strategies.- 4.1. Test Strategies.- 4.2. Medium-Volume Test Strategy.- 4.3. High-Volume Test Strategy.- 4.4. PCB Test Strategy Evaluation.- 5. The Rework Station and Networking.- 5.1. The Rework Station.- 5.2. Rework Effectiveness.- 5.3. Paperless Repair System.- 5.4. Computer-Aided Repair.- 5.5. Networking.- 5.6. Test Area Management System.- 6. In-Circuit Testing Philosophy.- 6.1. UUT Fixture Verification.- 6.2. Shorts Opens Test.- 6.3. Analog Measurement.- 6.4. Analog Testing.- 6.5. Operational Amplifiers.- 6.6. Analog Testing Summary.- 6.7. Device Orientation.- 6.8. Digital Testing.- 6.9. Test Program Preparation.- 6.10. IEEE-488 Instrumentation.- 7. In-Circuit Tester.- 7.1. Computer Subsystem.- 7.2. Switching and Measurement Subsystem.- 7.3. UUT Interface Subsystem.- 7.4. Generic In-Circuit Tester.- 7.5. OperatingSoftware.- 7.6. Test Executive.- 7.7. Test Programming.- 7.8. Test Programming Station.- 7.9. Bare-Board Shorts and Continuity Tester.- 7.10. Test Fixture Systems.- 7.11. PCB Layout Guidelines for Testability.- 8. In-Circuit Testers for Service and Repair.- 8.1. Service Repair Strategies.- 8.2. Service Problems.- 8.3. Board Float.- 8.4. Board Mix.- 8.5. Fault Spectrum.- 8.6. PCB Population.- 8.7. Test Requirements.- 8.8. Capital Expenditure.- 8.9. Service ATE Requirements.- 8.10. Functional and In-Circuit Comparison.- 8.11. Functional and In-Circuit Summary.- 8.12. Generic Service In-Circuit Tester.- 9. In-Circuit Tester Evaluation.- 9.1. Preparation for Vendor Investigation.- 9.2. Company Evaluation.- 9.3. Test Program Software.- 9.4. Operating System Software.- 9.5. Test System Hardware.- 9.6. Vendor Support.- 9.7. Ratio Evaluation.- 10. Financial Justification.- 10.1. Production In-Circuit Tester.- 10.2. Service In-Circuit Tester.- References.