Handbook of Moire Measurement
Herausgeber: Walker, C a
Handbook of Moire Measurement
Herausgeber: Walker, C a
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Since its development in the late 1970s, the Moiré Fringe method has become a standard technique for measuring the behavior of materials and structures. Edited by one of the technique's co-inventors, this book brings together extended case studies from experts in the field. Emphasizing applications to real situations, the book presents a very reada
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Since its development in the late 1970s, the Moiré Fringe method has become a standard technique for measuring the behavior of materials and structures. Edited by one of the technique's co-inventors, this book brings together extended case studies from experts in the field. Emphasizing applications to real situations, the book presents a very reada
Produktdetails
- Produktdetails
- Verlag: CRC Press
- Seitenzahl: 501
- Erscheinungstermin: 26. November 2019
- Englisch
- Abmessung: 234mm x 156mm x 27mm
- Gewicht: 721g
- ISBN-13: 9780367454425
- ISBN-10: 0367454424
- Artikelnr.: 58412776
- Verlag: CRC Press
- Seitenzahl: 501
- Erscheinungstermin: 26. November 2019
- Englisch
- Abmessung: 234mm x 156mm x 27mm
- Gewicht: 721g
- ISBN-13: 9780367454425
- ISBN-10: 0367454424
- Artikelnr.: 58412776
CA Walker Department of Mechanical Engineering, University of Strathclyde, UK
1 Introduction
1.1 A brief history of the moiré method
References
CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT-THE MOIRÉ MICROSCOPE
2.1 Nonlinear analysis of interferometric moiré fringes
2.1.1 Example fringe data reduction
References
2.2 Microscopic moiré interferometry
2.2.1 Immersion interferometer
2.2.1.1 Optical configuration
2.2.1.2 Four-beam immersion interferometer
2.2.2 Mechanical configuration
2.2.3 Fringe shifting and O/DFM method
References
2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry
2.3.1 Specimen preparation
2.3.2 Thin small outline package
2.3.3 Leadless chip carrier
2.3.4 Effect of underfill encapsulation on flip chip solder bump
2.3.5 Plated through hole
References
2.4 Titanium in elastic tension: micromechanical deformation
2.4.1 Introduction
2.4.2 Specimen and loading fixture
2.4.3 Experimental procedure and fringe patterns
2.4.4 Anomalous strains along the grain boundaries
2.4.5 Discussion
References
2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite
2.5.1 Experimental procedure and fringe patterns
2.5.2 Analysis and results
2.5.3 Discussion
References
CHAPTER 3: FRACTURE MECHANICS
3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load
3.1.1.1 Introduction
3.1.1.2 Experimental details
3.1.1.3 Measurement of Von Mises yield locus
3.1.1.4 Discussion of results
3.1.1.5 Conclusions
References
3.1.2 Deformation around fatigue cracks from moiré fringe measurement
3.1.2.1 Introduction
3.1.2.2 Basic crack-tip models
3.1.2.2.1 Stationary crack under monotonie loading
3.1.2.2.2 Stationary crack under cyclic loading
3.1.2.3 Experimental details
3.1.2.4 Fatigue crack-tip deformation
3.1.2.4.1 Local yielding
3.1.2.4.2 Non-singular stresses
3.1.2.4.3 Cyclic plasticity
3.1.2.4.4 Local mode-mixity
3.1.2.5 Summary
Acknowledgment
References
3.2.1 Applications of moiré to cellulosic (paper and woo
1.1 A brief history of the moiré method
References
CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT-THE MOIRÉ MICROSCOPE
2.1 Nonlinear analysis of interferometric moiré fringes
2.1.1 Example fringe data reduction
References
2.2 Microscopic moiré interferometry
2.2.1 Immersion interferometer
2.2.1.1 Optical configuration
2.2.1.2 Four-beam immersion interferometer
2.2.2 Mechanical configuration
2.2.3 Fringe shifting and O/DFM method
References
2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry
2.3.1 Specimen preparation
2.3.2 Thin small outline package
2.3.3 Leadless chip carrier
2.3.4 Effect of underfill encapsulation on flip chip solder bump
2.3.5 Plated through hole
References
2.4 Titanium in elastic tension: micromechanical deformation
2.4.1 Introduction
2.4.2 Specimen and loading fixture
2.4.3 Experimental procedure and fringe patterns
2.4.4 Anomalous strains along the grain boundaries
2.4.5 Discussion
References
2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite
2.5.1 Experimental procedure and fringe patterns
2.5.2 Analysis and results
2.5.3 Discussion
References
CHAPTER 3: FRACTURE MECHANICS
3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load
3.1.1.1 Introduction
3.1.1.2 Experimental details
3.1.1.3 Measurement of Von Mises yield locus
3.1.1.4 Discussion of results
3.1.1.5 Conclusions
References
3.1.2 Deformation around fatigue cracks from moiré fringe measurement
3.1.2.1 Introduction
3.1.2.2 Basic crack-tip models
3.1.2.2.1 Stationary crack under monotonie loading
3.1.2.2.2 Stationary crack under cyclic loading
3.1.2.3 Experimental details
3.1.2.4 Fatigue crack-tip deformation
3.1.2.4.1 Local yielding
3.1.2.4.2 Non-singular stresses
3.1.2.4.3 Cyclic plasticity
3.1.2.4.4 Local mode-mixity
3.1.2.5 Summary
Acknowledgment
References
3.2.1 Applications of moiré to cellulosic (paper and woo
1 Introduction
1.1 A brief history of the moiré method
References
CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT-THE MOIRÉ MICROSCOPE
2.1 Nonlinear analysis of interferometric moiré fringes
2.1.1 Example fringe data reduction
References
2.2 Microscopic moiré interferometry
2.2.1 Immersion interferometer
2.2.1.1 Optical configuration
2.2.1.2 Four-beam immersion interferometer
2.2.2 Mechanical configuration
2.2.3 Fringe shifting and O/DFM method
References
2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry
2.3.1 Specimen preparation
2.3.2 Thin small outline package
2.3.3 Leadless chip carrier
2.3.4 Effect of underfill encapsulation on flip chip solder bump
2.3.5 Plated through hole
References
2.4 Titanium in elastic tension: micromechanical deformation
2.4.1 Introduction
2.4.2 Specimen and loading fixture
2.4.3 Experimental procedure and fringe patterns
2.4.4 Anomalous strains along the grain boundaries
2.4.5 Discussion
References
2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite
2.5.1 Experimental procedure and fringe patterns
2.5.2 Analysis and results
2.5.3 Discussion
References
CHAPTER 3: FRACTURE MECHANICS
3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load
3.1.1.1 Introduction
3.1.1.2 Experimental details
3.1.1.3 Measurement of Von Mises yield locus
3.1.1.4 Discussion of results
3.1.1.5 Conclusions
References
3.1.2 Deformation around fatigue cracks from moiré fringe measurement
3.1.2.1 Introduction
3.1.2.2 Basic crack-tip models
3.1.2.2.1 Stationary crack under monotonie loading
3.1.2.2.2 Stationary crack under cyclic loading
3.1.2.3 Experimental details
3.1.2.4 Fatigue crack-tip deformation
3.1.2.4.1 Local yielding
3.1.2.4.2 Non-singular stresses
3.1.2.4.3 Cyclic plasticity
3.1.2.4.4 Local mode-mixity
3.1.2.5 Summary
Acknowledgment
References
3.2.1 Applications of moiré to cellulosic (paper and woo
1.1 A brief history of the moiré method
References
CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT-THE MOIRÉ MICROSCOPE
2.1 Nonlinear analysis of interferometric moiré fringes
2.1.1 Example fringe data reduction
References
2.2 Microscopic moiré interferometry
2.2.1 Immersion interferometer
2.2.1.1 Optical configuration
2.2.1.2 Four-beam immersion interferometer
2.2.2 Mechanical configuration
2.2.3 Fringe shifting and O/DFM method
References
2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry
2.3.1 Specimen preparation
2.3.2 Thin small outline package
2.3.3 Leadless chip carrier
2.3.4 Effect of underfill encapsulation on flip chip solder bump
2.3.5 Plated through hole
References
2.4 Titanium in elastic tension: micromechanical deformation
2.4.1 Introduction
2.4.2 Specimen and loading fixture
2.4.3 Experimental procedure and fringe patterns
2.4.4 Anomalous strains along the grain boundaries
2.4.5 Discussion
References
2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite
2.5.1 Experimental procedure and fringe patterns
2.5.2 Analysis and results
2.5.3 Discussion
References
CHAPTER 3: FRACTURE MECHANICS
3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load
3.1.1.1 Introduction
3.1.1.2 Experimental details
3.1.1.3 Measurement of Von Mises yield locus
3.1.1.4 Discussion of results
3.1.1.5 Conclusions
References
3.1.2 Deformation around fatigue cracks from moiré fringe measurement
3.1.2.1 Introduction
3.1.2.2 Basic crack-tip models
3.1.2.2.1 Stationary crack under monotonie loading
3.1.2.2.2 Stationary crack under cyclic loading
3.1.2.3 Experimental details
3.1.2.4 Fatigue crack-tip deformation
3.1.2.4.1 Local yielding
3.1.2.4.2 Non-singular stresses
3.1.2.4.3 Cyclic plasticity
3.1.2.4.4 Local mode-mixity
3.1.2.5 Summary
Acknowledgment
References
3.2.1 Applications of moiré to cellulosic (paper and woo