Michael Pecht, Rakish Agarwal, F Patrick McCluskey, Terrance J Dishongh, Sirus Javadpour, Rahul Mahajan

Electronic Packaging Materials and Their Properties

• Gebundenes Buch

Produktbeschreibung

This practical book examines packaging architecture, outlining the classification of materials and their uses for various tasks requiring performance over time. Topics include reliability, design, and cost; heat dissipation problems; and signal delay. TOC:Introduction.- Properties of Electronic Packaging Materials.- Zeroth-Level Packaging Materials.- First-Level Packaging Materials. Second-Level Packaging Materials.- Third-Level Packaging Materials.- Summary. Appendices. Index.

Produktdetails

• Verlag: CRC Press
• Seitenzahl: 120
• Erscheinungstermin: 18. Dezember 1998
• Englisch
• Abmessung: 241mm x 161mm x 12mm
• Gewicht: 354g
• ISBN-13: 9780849396250
• ISBN-10: 0849396255
• Artikelnr.: 20988330

Autorenporträt

Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

Inhaltsangabe

Introduction
Properties of Electronics Packaging Materials
Electrical Properties
Thermal and Thermomechanical Properties
Mechanical Properties
Chemical Properties
Miscellaneous Properties
Zeroth-Level Packaging Materials
Semiconductors
Attachment Materials
Substrates
First-Level Packaging Materials
Wire Interconnects
Tape Interconnects
Case Materials
Lid Seals
Leads
Second-Level Packaging Materials
Reinforcement Fiber Materials
Resins
Laminates
Constraining Cores
Flexible Wiring Board Materials
Conductor Metals in Laminates
Conformal Coatings
Third-Level Packaging Materials
Backpanel Materials
Connectors Materials
Cables and Flex Circuit Materials
Summary
Appendices
Index