This book documents the proceedings of the Second International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications held under the auspices of MST Conferences in Newark, New Jersey.
This book documents the proceedings of the Second International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications held under the auspices of MST Conferences in Newark, New Jersey.
Part 1: Synthesis, Properties and Bulk Characterization 1. Poly(amic acid)s and their ionic salt solutions: Synthesis, characterization and stability study 2. A new interpretation of the kinetic model for the imidization reaction of PMDA-ODA and BPDA-PDA poly(amic acid)s 3. Synthesis and characterization of new organosoluble poly(ether imide)s derived from various novel bis(ether anhydride)s 4. Synthesis of novel polyimides from dianhydrides with flexible side chains 5. Polyimides based on rhenium(I) diimine complexes 6. New highly phenylated bis(phthalic) and bis(naphthalic) anhydrides and polyimides therefrom 7. New photoalignable polyimides and their ability to control liquid-crystal alignment 8. Proton conducting polyimides from novel sulfonated diamines 9. High-modulus poly(p-phenylenepyromellitimide) films obtained using a novel gel-drawing technique 10. Effect of structure on the thermal behaviour of bisitaconimide resins 11. l-Amino-4,5-8-naphthalenetricarboxylic acid-l,8-lactam-4,5-imide-containing macrocycles: Synthesis, molecular modeling and polymerization 12. Synthesis of aromatic benzoxazole polymers for high Tg, low dielectric properties 13. Polybenzobisthiazoles ¿ Critical issues in their performance and properties 14. Electrical breakdown and electrostatic phenomena in ultra-thin polyimide Langmuir-Blodgett films 15. Humid ageing of polyetherimide: Chemical and physical interactions with water 16. Transport of water in high Tg polymers: A comparison between interacting and non-interacting systems Part 2: Surface Modification, Interfacial or Adhesion Aspects and Applications 17. New developments in the adhesion promotion of electroless Ni or Cu films to polyimide substrates 18. Surface modification of polyimide to improve its adhesion to deposited copper layer 19. Study on the structure and adhesion of copper thin films on chemically modified polyimide surfaces 20. Chemical interaction of Fe, Ni and Au with poly(vinyl chloride) and poly(tetrafluoroet
Part 1: Synthesis, Properties and Bulk Characterization 1. Poly(amic acid)s and their ionic salt solutions: Synthesis, characterization and stability study 2. A new interpretation of the kinetic model for the imidization reaction of PMDA-ODA and BPDA-PDA poly(amic acid)s 3. Synthesis and characterization of new organosoluble poly(ether imide)s derived from various novel bis(ether anhydride)s 4. Synthesis of novel polyimides from dianhydrides with flexible side chains 5. Polyimides based on rhenium(I) diimine complexes 6. New highly phenylated bis(phthalic) and bis(naphthalic) anhydrides and polyimides therefrom 7. New photoalignable polyimides and their ability to control liquid-crystal alignment 8. Proton conducting polyimides from novel sulfonated diamines 9. High-modulus poly(p-phenylenepyromellitimide) films obtained using a novel gel-drawing technique 10. Effect of structure on the thermal behaviour of bisitaconimide resins 11. l-Amino-4,5-8-naphthalenetricarboxylic acid-l,8-lactam-4,5-imide-containing macrocycles: Synthesis, molecular modeling and polymerization 12. Synthesis of aromatic benzoxazole polymers for high Tg, low dielectric properties 13. Polybenzobisthiazoles ¿ Critical issues in their performance and properties 14. Electrical breakdown and electrostatic phenomena in ultra-thin polyimide Langmuir-Blodgett films 15. Humid ageing of polyetherimide: Chemical and physical interactions with water 16. Transport of water in high Tg polymers: A comparison between interacting and non-interacting systems Part 2: Surface Modification, Interfacial or Adhesion Aspects and Applications 17. New developments in the adhesion promotion of electroless Ni or Cu films to polyimide substrates 18. Surface modification of polyimide to improve its adhesion to deposited copper layer 19. Study on the structure and adhesion of copper thin films on chemically modified polyimide surfaces 20. Chemical interaction of Fe, Ni and Au with poly(vinyl chloride) and poly(tetrafluoroet
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