Solder Joint Technology - Tu, King-Ning
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The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems. …mehr

Produktbeschreibung
The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
  • Produktdetails
  • Springer Series in Materials Science 92
  • Verlag: Springer / Springer New York / Springer, Berlin
  • Softcover reprint of hardcover 1st ed. 2007
  • Seitenzahl: 388
  • Erscheinungstermin: 19. November 2010
  • Englisch
  • Abmessung: 235mm x 155mm x 20mm
  • Gewicht: 586g
  • ISBN-13: 9781441922847
  • ISBN-10: 1441922849
  • Artikelnr.: 32221661
Autorenporträt
Solder joints are ubiquitous in electronic consumer products. With the European Union s directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration-induced failure in solder joints are serious issues. Analyzing and improving reliability is quite complicated due to the combined effects of electrical, mechanical, chemical, and thermal forces on solder joints. This book thoroughly examines advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods to prevent common reliability problems.
Inhaltsangabe
Introduction. -Surface mount technology, pin-through-hole technology, & flip chip technology. -Reliability issues of solder joints: spalling, low cycle fatigue, electromigration, ductile-to-brittle transition in impact, Sn whisker. -Trend in electronic packaging: Chip-packaging interaction, more IMC formation in smaller solder joints. -Cu-Sn reaction in bulk samples. -Wetting reaction in bulk samples of eutectic SnPb on Cu foil. -Ternary phase diagram of Sn-Pb-Cu. -Wetting reaction in bulk samples of Pb-free solders on Cu foil . -Solid state reaction in bulk samples of eutectic SnPb on Cu foil. -Solid state reaction in bulk samples of Pb-free on Cu foil. -Comparison between wetting and solid state reactions. -Cu-Sn reaction in thin film samples. -Room temperature reaction in bimetallic thin films of Sn and Cu. -Wetting reaction of molten SnPb solders on thin films of Au/Cu/Cr. -Spalling of Cu-Sn IMC. -Wetting reaction of molten eutectic SnPb on thin films of Cu/Ni(V)/Al. -Wetting