King-Ning Tu

Solder Joint Technology (eBook, PDF)

• Format: PDF

Produktbeschreibung

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed. TOC:Introduction.- Cu-Sn reaction in bulk samples.- Cu-Sn reaction in thin film samples. Cu-Sn reaction in flip chip solder joints and electromigration.- Kinetic analysis of flux-driven ripening of Cu-Sn scallops.- Polarity effect of electromigration on solder reactions.- Ductile-to-brittle transition of solder joints affected by Cu-Sn reactions.- Spontaneous Sn whisker growth on Cu leadframe finished with Pb-free.- Comparison to solder reactions on other metals.

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Produktdetails

• Verlag: Springer-Verlag GmbH
• Erscheinungstermin: 27.07.2007
• Englisch
• ISBN-13: 9780387388922
• Artikelnr.: 37287775

Autorenporträt

Solder joints are ubiquitous in electronic consumer products. With the European Union s directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration-induced failure in solder joints are serious issues. Analyzing and improving reliability is quite complicated due to the combined effects of electrical, mechanical, chemical, and thermal forces on solder joints. This book thoroughly examines advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods to prevent common reliability problems.

Inhaltsangabe

Introduction. -Surface mount technology, pin-through-hole technology, & flip chip technology. -Reliability issues of solder joints: spalling, low cycle fatigue, electromigration, ductile-to-brittle transition in impact, Sn whisker. -Trend in electronic packaging: Chip-packaging interaction, more IMC formation in smaller solder joints. -Cu-Sn reaction in bulk samples. -Wetting reaction in bulk samples of eutectic SnPb on Cu foil. -Ternary phase diagram of Sn-Pb-Cu. -Wetting reaction in bulk samples of Pb-free solders on Cu foil . -Solid state reaction in bulk samples of eutectic SnPb on Cu foil. -Solid state reaction in bulk samples of Pb-free on Cu foil. -Comparison between wetting and solid state reactions. -Cu-Sn reaction in thin film samples. -Room temperature reaction in bimetallic thin films of Sn and Cu. -Wetting reaction of molten SnPb solders on thin films of Au/Cu/Cr. -Spalling of Cu-Sn IMC. -Wetting reaction of molten eutectic SnPb on thin films of Cu/Ni(V)/Al. -Wetting