Li (Li Yang) Suny
Gebundenes Buch

Sip System-In-Package Design and Simulation

Mentor Ee Flow Advanced Design Guide

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An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flowWritten by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP des...