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Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the…mehr

Produktbeschreibung
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes. TOC:Overview: Electronic Manufacturing and the IC.- Integrated Circuit Manufacturing - A Technology Resource.- Packaging the IC.- The Chip Scale Package.- Multichip Packaging.- Known Good Die.- Chip On Board.- Chip & Wire Assembly.- Flip Chip - The Bumping Processes.- Flip Chip Assembly.- Tape Automated Bonding ¿ TAB.- HDI Substrate Manufacturing ¿The Thin Film Process.- HDI Substrate Manufacturing - The Thick Film Process.- HDI Substrate Manufacturing ¿ The Cofired Ceramic Tape Process.- HDI Manufacture - The Printed Wiring Board (PWB), The Laminate Multichip Module (MCM-L), The HDI PWB.

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  • Produktdetails
  • Verlag: Springer-Verlag GmbH
  • Erscheinungstermin: 24.04.2007
  • Englisch
  • ISBN-13: 9780387339139
  • Artikelnr.: 37287828
Autorenporträt
Mr. Greig has been a consultant since 1988. He specializes in packaging, assembly, and high density interconnects, focusing on technology assessments, engineering development, and manufacturing implementation. He also performs technical audits of manufacturing operations which include materials and process evaluations and supporting documentation, directed towards yield improvement and enhanced product quality and reliability. He has developed several courses covering latest developments in microelectronic packaging and assembly that have been and are currently offered at the various national symposia. Several have also been included in the Continuing Engineering Education Programs at U. of Wisconsin and Rutgers University
Inhaltsangabe
Electronic Manufacturing and the Integrated Circuit.- Integrated Circuit Manufacturing: A Technology Resource.- Packaging the IC-Single Chip Packaging.- The Chip Scale Package.- Multichip Packaging.- Known Good Die (KGD).- Packaging Options-Chip on Board.- Chip & Wire Assembly.- Tape Automated Bonding-TAB.- Flip Chip-The Bumping Processes.- Flip Chip Assembly.- HDI Substrate Manufacturing Technologies: Thin Film Technology.- HDI Substrate Manufacturing Technologies: Thick Film Technology.- HDI Substrate Manufacturing Technologies: Cofired Ceramic.- Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.