Produktbild: Integrated Circuits for AI Data Centers
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Integrated Circuits for AI Data Centers From Semiconductor Scaling to Photonic and Quantum Computing

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Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

10.02.2027

Abbildungen

Approx. 100 p. 25 illus. in color.

Herausgeber

Vikas Choudhary + weitere

Verlag

Springer

Seitenzahl

160

Maße (B/H)

15,5/23,5 cm

Sprache

Englisch

ISBN

978-3-032-38949-7

Beschreibung

Portrait

Vikas Choudhary is Senior Vice President (SVP) and General Manager of the Connectivity and Storage Business Unit at MaxLinear. He has driven multi-billion-dollar product launches disrupting markets in storage, networking, automotive, and consumer electronics. He has also held leadership positions at Analog Devices, Murata, PMC-Sierra, and STMicroelectronics, working the full physical layer of computing from analog and RF through high-speed connectivity and storage. He holds an MBA from the Kellogg School of Management at Northwestern University and an MS from UCLA, and has authored multiple books, refereed papers, and patents.

Krzysztof (Kris) Iniewski is Director of Detector Architecture and Applications at Redlen Technologies Inc. in Port Moody, British Columbia, Canada. Over fifteen years at Redlen he has led development of highly integrated CdZnTe detector products for medical imaging and security applications. Before Redlen he held management and academic positions at PMC-Sierra, the University of Alberta, Simon Fraser University, the University of British Columbia, and the University of Toronto. He has published more than 150 research papers in international journals and conference proceedings, and holds more than 25 international patents granted in the United States, Canada, France, Germany, and Japan. He has written and edited more than 75 books for Springer, Wiley, Cambridge University Press, McGraw-Hill, and CRC Press. He is a frequent invited speaker and has consulted for organizations internationally.

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

10.02.2027

Abbildungen

Approx. 100 p. 25 illus. in color.

Herausgeber

Verlag

Springer

Seitenzahl

160

Maße (B/H)

15,5/23,5 cm

Sprache

Englisch

ISBN

978-3-032-38949-7

Herstelleradresse

Springer Nature Customer Service Center GmbH
Europaplatz 3
69115 Heidelberg
DE
ProductSafety@springernature.com

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  • Produktbild: Integrated Circuits for AI Data Centers
  • A Brief Introduction to AI.- Evolution of Silicon Computing Chips for the AI Era.- Mapping Neural Networks and Transformers to AI Hardware from an Energy Consumption Perspective.- Silicon Photonics and Connectivity for Data Centers.- The NeoCloud Revolution: Storage-Centric Acceleration and Emerging AI Architecture.- System-Level Hardware Evolution for Artificial Intelligence.- Hyperdimensional Computing for Energy-Efficient AI Hardware: From Hypervector Operations to Memory-Centric IC Implementations.- Architectural Roles and Integration of Quantum, Photonic, and Neuromorphic Computing.- Integrating Quantum Computing into AI Data Center Infrastructure.- Beyond Classical Limits: Quantum Computing as a Computational Engine for AI Workloads.