Produktbild: Transindividual Intelligence
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Transindividual Intelligence Proceedings of the 7th International Conference on Computational Design and Robotic Fabrication (CDRF 2025)

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Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

27.07.2026

Abbildungen

XII, 341 illus., 170 illus. in color., schwarz-weiss Illustrationen, farbige Illustrationen

Herausgeber

Yige Liu + weitere

Verlag

Springer Singapore

Seitenzahl

538

Maße (L/B)

23,5/15,5 cm

Sprache

Englisch

ISBN

978-981-9206-14-8

Beschreibung

Portrait

Yige Liu is an Assistant Professor in the College of Architecture and Urban Planning (CAUP) at Tongji University. She is also a committee member of the Computational Design Academic Committee of the Architectural Society of China. Her research focuses on cross-disciplinary innovation in architecture, integrating performance-based tectonics, artificial intelligence, robotic knitting and CNC weaving. She received her Ph.D. from Tongji University in 2022. She visited the Architecture Department at Massachusetts Institute of Technology as a visiting student for 2016–2017. Her research has been widely published in peer-reviewed international and national journals as well as conference proceedings.

Hua Chai is an Associate Professor at the College of Architecture and Urban Planning (CAUP) of Tongji University. He serves as a committee member of the Computational Design Academic Committee of the Architectural Society of China. His research focuses on advanced robotic production technologies for complex timber building systems. He received his Ph.D. from Tongji University in 2022. He visited the Institute for Computational Design and Construction (ICD) at the University of Stuttgart for one year as a guest researcher in 2020. His research has been widely published in journals and international conferences, including Automation in Construction, ACADIA, Rob|Arch, and Fabricate. He has been awarded CAADRIA Young in 2015, DigitalFUTURES Young in 2022. He was also awarded the fellowship of China National Postdoctoral Program for Innovative Talents in 2022.

 

Ding Wen 'Nic' Bao is a Senior Lecturer in Architecture, PhD supervisor, and Architecture Technology Course Coordinator at RMIT University, where he directs the FormX Research Lab. He is a member of the Centre for Innovative Structures and Materials, RMIT Post-Carbon Research Centre, and Centre for Future Construction. Nic's research integrates architecture, artificial intelligence, computational design, structural engineering, robotic fabrication, and intelligent construction, with a focus on performance-driven digital design and delivery. He is a registered architect in Australia and the US, and a RIBA Chartered Architect in UK. He is also the Director of B.W Architects (BWA) and a partner at Ameba. Nic serves as a committee member of the Australian Institute of Architects, Secretary of CAADRIA and DigitalFUTURES, and former board member and Technology Officer of ACADIA. His work has been widely exhibited internationally, including at IASS Expo, Shenzhen Biennale, Melbourne Design Week, Venice Biennale, and ACADIA + CAADRIA joint Exhibition.

 

Philip F. Yuan is a Professor and the Dean of the College of Architecture and Urban Planning (CAUP) at Tongji University, and an Honorary Fellow of the American Institute of Architects (Hon.FAIA). He has served as the Thomas Jefferson Professor at the University of Virginia (UVA, 2019). He is the founder of DigitalFUTURES and Conference of Computational Design and Robotic Fabrication. He is also the Editor-in-Chief of the journal Architectural Intelligence, the founder of Archi-Union Architects and Fab-Union Technology, and council member of the UIA Professional Practice Commission (PPC). Yuan is a pioneer in architectural intelligence and robotic fabrication, making achievements in both academic research and architectural practice. He emphasizes the integration of technological innovation and architectural culture, building environment and ethics, constantly seeking human-machine collaboration in the era of post-humanism.

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

27.07.2026

Abbildungen

XII, 341 illus., 170 illus. in color., schwarz-weiss Illustrationen, farbige Illustrationen

Herausgeber

Verlag

Springer Singapore

Seitenzahl

538

Maße (L/B)

23,5/15,5 cm

Sprache

Englisch

ISBN

978-981-9206-14-8

Herstelleradresse

Springer Singapore
No. 12-2F 101 Business Park
47100 Puchong, Selangor D.E.
MY
Email: [email protected]
Telephone: +49 6221 3454301
Fax: +49 6221 3454229

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