Practical Guide for the Reliable Packaging of Electronics Thermal and Mechanical Design and Analysis

1. ISSUES IN ELECTRONICS PACKAGING DESIGN. 2. BASIC HEAT TRANSFER: CONDUCTION, CONVECTION AND RADIATION. 3. CONDUCTIVE COOLING. 4. RADIATION COOLING. 5. FUNDAMENTALS OF CONVECTION COOLING. 6. COMBINED MODES, TRANSIENT HEAT TRANSFER AND ADVANCED MATERIALS. 7. BASICS OF VIBRATION AND ITS ISOLATION. 8. BASICS OF SHOCK MANAGEMENT. 9. INDUCED STRESSE. 10. ERROR PROOFING MEASUREMENTS. 11. MECHANICAL AND THERMOMECHANICAL CONCERNS.12. ACOUSTICS. 13. MECHANICAL FAILURES AND RELIABILITY. 14. ELECTRICAL FAILURES AND RELIABILITY. 15. CHEMICAL ATTACK FAILURES AND RELIABILITY. 16. RELIABILITY MODELS, PREDICTIONS AND CALCULATIONS. 17. DESIGN CONSIDERATIONS IN AN AVIONICS ELECTRONIC PACKAGE