Produktbild: Computer Vision – ECCV 2024 Workshops
Band 15626

Computer Vision – ECCV 2024 Workshops Milan, Italy, September 29–October 4, 2024, Proceedings, Part IV

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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

23.05.2025

Abbildungen

LV, 462 p. 155 illus., 143 illus. in color.

Herausgeber

Alessio Del Bue + weitere

Verlag

Springer

Seitenzahl

462

Maße (L/B/H)

23,5/15,5/2,8 cm

Gewicht

779 g

Sprache

Englisch

ISBN

978-3-031-92804-8

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

23.05.2025

Abbildungen

LV, 462 p. 155 illus., 143 illus. in color.

Herausgeber

Verlag

Springer

Seitenzahl

462

Maße (L/B/H)

23,5/15,5/2,8 cm

Gewicht

779 g

Sprache

Englisch

ISBN

978-3-031-92804-8

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: GPSR Kontakt

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  • Produktbild: Computer Vision – ECCV 2024 Workshops

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    .- NeuroSymbolic Visual Transform based on Logic Tensor Network for Defect Detection.



    .- Multimodal computer vision techniques for wooden utility pole density esti mation with contact-free sensing.



    .- Dynamic Label Injection for Imbalanced Industrial Defect Segmentation.



    .- XAI-guided Insulator Anomaly Detection for Imbalanced Datasets.



    .- Exploring Multi-modal Neural Scene Representations With Applications on Thermal Imaging.



    .- Foreground-Aware Knowledge Distillation for Enhanced Damage Detection.



    .- AnomalyFactory: Regard Anomaly Generation as Unsupervised Anomaly Localization.



    .- Interactive Explainable Anomaly Detection for Industrial Settings.



    .- DAS3D: Dual-modality Anomaly Synthesis for 3D Anomaly Detection.



    .- SQUAD: Scalar Quantized representation learning for Unsupervised Anomaly Detection and localization.



    .- Deep Unsupervised Segmentation of Log Point Clouds.



    .- A Computer Vision System for Automatic Edge Detection of Magnetic Grain Profile.



    .- Find the Assembly Mistakes: Error Segmentation for Industrial Applications.



    .- EM Based Nano-Scale Defect Analysis in Semiconductor Man ufacturing for Advanced IC Nodes.



    .- On The Relationship between Visual Anomaly-free and Anomalous Representations.



    .- DIE-VIS: an Automated Visual Inspection System for Cardboard Box Manufacturing.



    .- When the Small-Loss Trick is Not Enough: Multi-Label Image Classification with Noisy Labels Applied to CCTV Sewer Inspections.



    .- AnomalousPatchCore: Exploring the Use of Anomalous Samples in Industrial Anomaly Detection.



    .- Self-supervised Models are Strong Industrial Few-shot Classification Learners.



    .- Hyperspectral Imaging and Computer Vision Based Remote Monitoring of SO2 Emissions in Maritime Vessels.



    .- Temporal-consistent CAMs for Weakly Supervised Video Segmentation in Waste Sorting.



    .- Sequential PatchCore: Anomaly Detection for Surface Inspection using Synthetic Impurities.



    .- SplatPose+: Real Time Image-Based Pose-Agnostic 3D Anomaly Detection.



    .- BBD-Polyp: Weakly Supervised Polyp Segmentation via Bounding Box and



    Depth Map.



    .- ENSTRECT: A Stage-based Approach to 2.5D Structural Damage Detection.



    .- An Augmentation-based Model Re-adaptation Framework for Robust Image Segmentation.



    .- Meta Learning-Driven Iterative Refinement for Robust Anomaly Detection in Industrial Inspection.