Produktbild: Communication and Intelligent Systems
Band 1374

Communication and Intelligent Systems Proceedings of ICCIS 2024, Volume 4

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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

14.10.2025

Abbildungen

XX, 217 illus., 174 illus. in color., schwarz-weiss Illustrationen, farbige Illustrationen

Herausgeber

Harish Sharma + weitere

Verlag

Springer Singapore

Seitenzahl

525

Maße (L/B/H)

23,5/15,5/2,8 cm

Gewicht

920 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-981-9657-31-5

Beschreibung

Portrait

Harish Sharma is an associate professor at Rajasthan Technical University, Kota in Department of Computer Science & Engineering. He has worked at Vardhaman Mahaveer Open University Kota, and Government Engineering College Jhalawar. He received his B.Tech. and M.Tech. degree in Computer Engg. from Govt. Engineering College, Kota and Rajasthan Technical University, Kota in 2003 and 2009 respectively. He obtained his Ph.D. from ABV—Indian Institute of Information Technology and Management, Gwalior, India. He is secretary and one of the founder members of Soft Computing Research Society of India. He is a life time member of Cryptology Research Society of India, ISI, Kolkata. He is an associate editor of “International Journal of Swarm Intelligence (IJSI)” published by Inderscience.

Vivek Shrivastava has approx. 20 years of diversified experience of scholarship of teaching and learning, accreditation, research, industrial, and academic leadership in India, China, and USA. Presently he is holding the position of professor at National Institute of Technology Uttarakhand. Previously he has worked as dean in Research & Consultancy at National Institute of Technology Delhi. Prior to his academic assignments he has worked as system reliability engineer at SanDisk Semiconductors Shanghai China and USA. He has significant industrial experience of collaborating with industry and Government organizations at SanDisk Semiconductors he has made significant contribution to the design development of memory products. He has contributed to the development and delivery of Five-Year Integrated B.Tech. and M.Tech. Programme and Master programme at Gautam Buddha University Greater Noida.

Ashish Kumar Tripathi received his M.Tech. and Ph.D. degrees in computer science and engineering from the Department of Computer Science and Engineering, Delhi Technological University, Delhi, India, in 2013 and 2019 respectively. He is currently working as an assistant professor with the Department of Computer Science & Engineering, Malviya National Institute of Technology (MNIT), Jaipur, India. His research interests include big data analytics, social media analytics, soft computing, image analysis, and natural language processing. Dr. Tripathi has published several papers in international journals and conferences including IEEE transactions. He is an active reviewer for several journals of repute.

Lipo Wang received the Bachelor degree from National University of Defense Technology (China) and Ph.D. from Louisiana State University (USA). He is presently on the faculty of the School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore. His research interest is artificial intelligence with applications to image/video processing, biomedical engineering, and data mining. He has 330+ publications, a U.S. patent in neural networks and a patent in systems. He has co-authored 2 monographs and (co-)edited 15 books. He has 8,000+ Google Scholar citations, with H-index 43. He was keynote speaker for 36 international conferences. He is/was an associate editor/editorial board member of 30 international journals, including 4 IEEE Transactions, and guest editor for 10 journal special issues.

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

14.10.2025

Abbildungen

XX, 217 illus., 174 illus. in color., schwarz-weiss Illustrationen, farbige Illustrationen

Herausgeber

Verlag

Springer Singapore

Seitenzahl

525

Maße (L/B/H)

23,5/15,5/2,8 cm

Gewicht

920 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-981-9657-31-5

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: [email protected]

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