Lead-free Soldering Process Development and Reliability
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Form:Einzelkauf Download
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Sprache:Englisch
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eBook Format:ePUB 3
- ePUB 3 121,99 € ausgewählt
- PDF 121,99 €
121,99 €
inkl. gesetzl. MwSt.Beschreibung
Produktdetails
Format
ePUB 3
Kopierschutz
Ja
Family Sharing
Nein
Text-to-Speech
Ja
Erscheinungsdatum
23.06.2020
Herausgeber
Jasbir BathVerlag
WileySeitenzahl
(Printausgabe)
Dateigröße
29677 KB
Auflage
1. Auflage
Sprache
Englisch
EAN
9781119481935
Covering the major topics in lead-free soldering
Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production.
Among other topics, the book addresses:
· Developments in process engineering (SMT, Wave, Rework, Paste Technology)
· Low temperature, high temperature and high reliability alloys
· Intermetallic compounds
· PCB surface finishes and laminates
· Underfills, encapsulants and conformal coatings
· Reliability assessments
In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book's explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers.
Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production.
Among other topics, the book addresses:
· Developments in process engineering (SMT, Wave, Rework, Paste Technology)
· Low temperature, high temperature and high reliability alloys
· Intermetallic compounds
· PCB surface finishes and laminates
· Underfills, encapsulants and conformal coatings
· Reliability assessments
In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book's explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers.
Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
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