Produktbild: Transactions on Engineering Technologies
- 12%

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

18.08.2018

Abbildungen

IX, 165 illus., schwarz-weiss Illustrationen

Herausgeber

Sio-Iong Ao + weitere

Verlag

Springer Singapore

Seitenzahl

407

Maße (L/B/H)

24,1/16/2,9 cm

Gewicht

734 g

Auflage

1st ed. 2019

Sprache

Englisch

ISBN

978-981-13-0745-4

Beschreibung

Portrait

Dr. Sio-Iong Ao finished his doctoral research in The University of Hong Kong and postdoctoral researches in the University of Oxford and Harvard University and is a former visiting professor of Cranfield University, UK and University of Wyoming, USA.

Prof. Len Gelman is Professor and Chair in Signal Processing and Condition Monitoring, and Director, the Centre for Efficiency and Performance Engineering, School of Computing and Engineering, The University of Huddersfield, UK. He has more than 25 year’s experience in signal processing and vibro-acoustic monitoring of complex mechanical systems (e.g. rotating, reciprocating machinery, etc.) both in industry and academia. He has been Principal Investigator on numerous contracts and grants, including grants from the USA National Academy of Sciences, USA National Research Council, USA International Science Foundation, USA Civilian Research and Development Foundation (twice), USA MacArthur Foundation, Lady Davis, Israel, Centro Volta, Italy. He is Principal Investigator on UK EPSRC, UK DTI (three times), UK Royal Society, Rolls Royce (two times) and Shell grants.

Dr. Haeng-Kon Kim is currently a Dean of engineering college and a professor in the Department of Computer Engineering Catholic University of Daegu, in Korea. He has been a research staff member in Bell Lab. and NASA center in U.S.A. He has taught in Central Michigan Univ. in U.S.A. during his Sabbatical (Dec., 20, 2000 ~ Feb., 20,2002).

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

18.08.2018

Abbildungen

IX, 165 illus., schwarz-weiss Illustrationen

Herausgeber

Verlag

Springer Singapore

Seitenzahl

407

Maße (L/B/H)

24,1/16/2,9 cm

Gewicht

734 g

Auflage

1st ed. 2019

Sprache

Englisch

ISBN

978-981-13-0745-4

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: ProductSafety@springernature.com

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