Produktbild: Printed Circuits Handbook, Seventh Edition

Printed Circuits Handbook, Seventh Edition

252,99 €

inkl. gesetzl. MwSt., Versandkostenfrei


Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

09.03.2016

Abbildungen

Illustrationen, nicht spezifiziert

Verlag

Mcgraw Hill Higher Education

Seitenzahl

1648

Maße (L/B/H)

24,1/18,7/6,3 cm

Gewicht

2620 g

Auflage

7th edition

Sprache

Englisch

ISBN

978-0-07-183395-0

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

09.03.2016

Abbildungen

Illustrationen, nicht spezifiziert

Verlag

Mcgraw Hill Higher Education

Seitenzahl

1648

Maße (L/B/H)

24,1/18,7/6,3 cm

Gewicht

2620 g

Auflage

7th edition

Sprache

Englisch

ISBN

978-0-07-183395-0

Herstelleradresse

Libri GmbH
Europaallee 1
36244 Bad Hersfeld
DE

Email: GPSR Kontakt

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  • Produktbild: Printed Circuits Handbook, Seventh Edition
  • Part 1: Printed Circuit Technology Drivers

    Chapter 1. Electronic Packaging and High-Density Interconnectivity Clyde F. Coombs, Jr., and Happy T. Holden 3
    1.1 Introduction / 3
    1.2 Measuring the Interconnectivity Revolution / 3
    1.3 Hierarchy of Interconnections / 6
    1.4 Factors Affecting Selection of Interconnections / 7
    1.5 ICs and Packages / 9
    1.6 Density Evaluations / 10
    1.7 Methods to Increase PWB Density / 13
    1.8 References / 18

    Chapter 2. Types of Printed Wiring Boards Hayao Nakahara 19
    2.1 Introduction / 19
    2.2 Classification of Printed Wiring Boards / 19
    2.3 Organic and Nonorganic Substrates / 21
    2.4 Graphical and Discrete-Wire Boards / 21
    2.5 Rigid and Flexible Boards / 22
    2.6 Graphically Produced Boards / 22
    2.7 Molded Interconnection Devices / 27
    2.8 Plated-Through-Hole Technologies / 27
    2.9 Summary / 30
    2.10 References / 30

    Part 2: Managing the Printed Circuit Supply Chain

    Chapter 3. Basics of Printed Circuit Supply Chain Management Tim Rodgers 33
    3.1 Introduction / 33
    3.2 General Business Considerations / 34
    3.3 Contract Manufacturers / 35
    3.4 Criteria for Evaluating Suppliers / 35
    3.5 Supplier Selection Criteria Example / 41

    Chapter 4. Design for Manufacturability Tim Rodgers 43
    4.1 General Principles / 43
    4.2 PCB/PCA Pricing Models / 44
    4.3 Process Cost Drivers / 49
    4.4 Production Yield and Design for Manufacturability / 51
    4.5 DFM Complexity Models / 59

    Chapter 5. Manufacturing Information, Documentation, Formatting, and Exchange Happy T. Holden 63
    5.1 Introduction / 63
    5.2 Manufacturing Information / 64
    5.3 Fabrication Information Exchange / 68
    5.4 Data Exchange Formats / 73
    5.5 Initial Design Review / 86
    5.6 Design Input / 94
    5.7 Design Analysis and Review / 99
    5.8 Acknowledgments / 99
    5.9 References / 100

    Chapter 6. Supplier Selection and Qualification Tim Rodgers 101
    6.1 Introduction / 101
    6.2 Evaluating Suppliers / 102
    6.3 Supplier Selection / 113
    6.4 Supplier Qualification / 114

    Chapter 7. Process Control, Monitoring, and Incoming Inspection Tim Rodgers 117
    7.1 Introduction / 117
    7.2 Process Capability and Process Control / 117
    7.3 Process Monitoring and Troubleshooting / 122
    7.4 Assessing a PCB Fabricators Capability / 122
    7.5 Testing and Inspection / 156
    7.6 Incoming Inspection / 158

    Chapter 8. Product Acceptance and Feedback Tim Rodgers 159
    8.1 Introduction / 159
    8.2 Design Qualification / 159
    8.3 Incoming Inspection and Lot Acceptance / 160
    8.4 Supplier Performance Management / 162
    8.5 Business Reviews / 165
    8.6 Strategic Supplier Management / 167

    Part 3: Materials

    Chapter 9. Introduction to Base Materials Edward Kelley and Douglas Trobough 171
    9.1 Introduction / 171
    9.2 Grades and Specifications / 171
    9.3 Properties Used to Classify Base Materials / 178
    9.4 Types of FR-4 / 184
    9.5 Laminate Identification Scheme / 185
    9.6 Prepreg Identification Scheme / 186
    9.7 Laminate and Prepreg Manufacturing Processes / 189
    9.8 References / 195

    Chapter 10. Base Material Components Edward Kelley and Douglas Trobough 197
    10.1 Introduction / 197
    10.2 Other Resin Systems / 201
    10.3 Legislative Issues / 203
    10.4 Additives / 207
    10.5 Reinforcements / 209
    10.6 Conductive Materials / 217
    10.7 References / 224

    Chapter 11. Properties of Base Materials Edward Kelley and Douglas Trobough 225
    11.1 Introduction / 225
    11.2 Thermal, Physical, and Me