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Produktbild: Design for Excellence C

Design for Excellence C

Aus der Reihe Wiley Series in Quality and Reliability Engineering

159,99 €

inkl. gesetzl. MwSt., Versandkostenfrei

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

05.04.2021

Verlag

John Wiley & Sons

Seitenzahl

400

Maße (L/B/H)

21,6/14/2,2 cm

Gewicht

608 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-1-119-10937-2

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

05.04.2021

Verlag

John Wiley & Sons

Seitenzahl

400

Maße (L/B/H)

21,6/14/2,2 cm

Gewicht

608 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-1-119-10937-2

Herstelleradresse

Libri GmbH
Europaallee 1
36244 Bad Hersfeld
DE

Email: GPSR Kontakt

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  • Produktbild: Design for Excellence C
  • Contributors xxiii
     
    Foreword xxv
     
    Preface xxvii
     
    Acknowledgments xxix
     
    Acronyms xxxi
     
    Introduction iii
     
    1 Introduction to Design for Excellence
     
    1.1 Design for Excellence (DfX) in Electronics Manufacturing 1
     
    1.2 Chapter 2 - Establishing a Reliability Program 3
     
    1.3 Chapter 3 - Design for Reliability (DfR) 3
     
    1.4 Chapter 4 - Design for the Use Environment: Reliability Testing
     
    and Test Plan Development 4
     
    1.5 Chapter 5 - Design for Manufacturability 5
     
    1.6 Chapter 6 - Design for Life Cycle Management 6
     
    1.7 Chapter 7 - Root Cause Problem-Solving, Failure Analysis, and Continual Improvement Techniques 1.8 Chapter 8 - Summary and Bringing It All Together 8
     
    2 Establishing a Reliability Program
     
    2.1 Introduction 9
     
    2.2 Best Practices and the Economics of a Reliability Program 12
     
    2.2.1 Best in Class Reliability Program Practices 13
     
    2.3 Elements of a Reliability Program 16
     
    2.3.1 Reliability Goals 17
     
    2.3.2 Defined Use Environments 18
     
    2.3.3 Software Reliability 21
     
    2.3.4 General Software Requirements 22
     
    2.4 Review of Commonly Used Probability and Statistics Concepts in Reliability
     
    2.4.1 Sources of Reliability Data 32
     
    2.4.2 Reliability Probability in Electronics 35
     
    2.4.3 Variation Statistics 35
     
    2.4.4 Reliability Statistics in Electronics 36
     
    2.5 Reliability Analysis and Prediction Methods 39
     
    2.6 Summary 45
     
    Bibliography 45
     
    3 Design for Reliability
     
    3.1 Introduction 47
     
    3.1.1 DfR at the Concept Stage 54
     
    3.2 Specifications (Product and Environment Definitions and Con
     
    cerns) 57
     
    3.3 Reliability Physics Analysis 61
     
    3.3.1 Reliability Physics Alternatives 68
     
    3.3.2 Reliability Physics Models and Examples 71
     
    3.3.3 Component Selection 77
     
    3.3.4 Critical Components 79
     
    3.3.5 Moisture Sensitivity Level 81
     
    3.3.6 Temperature Sensitivity Level 81
     
    3.3.7 Electrostatic Discharge 81
     
    3.3.8 Lifetime 83
     
    3.4 Surviving the Heat Wave 85
     
    3.5 Redundancy 89
     
    3.6 Plating Materials - Tin Whiskers 91
     
    3.7 Derating and Uprating 94
     
    3.8 Reliability of New Packaging Technologies 96
     
    3.9 Printed Circuit Boards 98
     
    3.9.1 Surface Finishes 99
     
    3.9.2 Laminate Selection 107
     
    3.9.3 Cracking and Delamination 108
     
    3.9.4 Plated Through Holes- Vias 109
     
    3.9.5 Conductive Anodic Filament 112
     
    3.9.6 Strain and Flexure Issues 116
     
    3.9.7 Pad Cratering 119
     
    3.9.8 PCB Buckling 120
     
    3.9.9 Electrochemical Migration 121
     
    3.9.10 Cleanliness 134
     
    3.10 Non-Functional Pads 138
     
    3.11 Wearout Mechanisms 139
     
    3.12 Conformal Coating and Potting 143
     
    Bibliography 150
     
    4 Design for the Use Environment: Reliability Testing and Test
     
    Plan Development
     
    4.1 Introduction 155
     
    4.1.1 Elements of a Testing Program 157
     
    4.1.2 Know The Environment 162
     
    4.2 Standards and Measurements 164
     
    4.3 Failure Inducing Stressors 165
     
    4.4 Common Test Types 166
     
    4.4.1 Temperature Cycling 166
     
    4.4.2 Temperature-Humidity-Bias Testing 168
     
    4.4.3 Electrical Connection 169
     
    4.4.4 Corrosion Tests 169
     
    4.4.5 Power Cycling 170
     
    4.4.6 Electrical Loads 170
     
    4.4.7 Mechanical Bending 171
     
    4.4.8 Random and Sinusoidal Vibration 172
     
    4.4.9 Mechanic