Produktbild: Materials and Failures in Mems and Nems

Materials and Failures in Mems and Nems

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Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

05.10.2015

Herausgeber

Atul Tiwari + weitere

Verlag

John Wiley & Sons

Seitenzahl

432

Maße (L/B/H)

25,7/18,3/2,8 cm

Gewicht

907 g

Sprache

Englisch

ISBN

978-1-119-08360-3

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

05.10.2015

Herausgeber

Verlag

John Wiley & Sons

Seitenzahl

432

Maße (L/B/H)

25,7/18,3/2,8 cm

Gewicht

907 g

Sprache

Englisch

ISBN

978-1-119-08360-3

Herstelleradresse

Libri GmbH
Europaallee 1
36244 Bad Hersfeld
DE

Email: gpsr@libri.de

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Die Leseprobe wird geladen.
  • Produktbild: Materials and Failures in Mems and Nems
  • 1 Carbon as a MEMS Material 1
    Amritha Rammohan and Ashutosh Sharma

    1.1 Introduction 1

    1.2 Structure and Properties of Glassy Carbon 3

    1.3 Fabrication of C-MEMS Structures 4

    1.4 Integration of C-MEMS Structures with Other Materials 15

    1.5 Conclusion 18

    2 Intelligent Model-Based Fault Diagnosis of MEMS 21
    Afshin Izadian

    2.1 Introduction 21

    2.2 Model-Based Fault Diagnosis 29

    2.3 Self-Tuning Estimation 49

    3 MEMS Heat Exchangers 63
    B. Mathew and L. Weiss

    3.1 Introduction 63

    3.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer 67

    3.3 MEMS Heat Sinks 86

    3.4 MEMS Heat Pipes 92

    3.6 Need for Microscale Internal Flow Passages 113

    4 Application of Porous Silicon in MEMS and Sensors Technology 121
    L. Sujatha, Chirasree Roy Chaudhuri and Enakshi Bhattacharya

    4.1 Introduction 121

    4.2 Porous Silicon in Biosensors 131

    4.3 Porous Silicon for Pressure Sensors 155

    4.4 Conclusion 165

    5 MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface 173
    Chengkuo Lee, Bo Woon Soon and You Qian

    5.1 Introduction 173

    5.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force 175

    5.3 Vertically Actuated U-Shape Nanowire NEMS Switch 184

    5.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics 187

    5.5 Summary 197

    6 On the Design, Fabrication, and Characterization of cMUT Devices 201
    J. Jayapandian, K. Prabakar, C.S. Sundar and Baldev Raj

    6.1 Introduction 201

    6.2 cMUT Design and Finite Element Modeling Simulation 203

    6.3 cMUT Fabrication and Characterization 205

    6.4 Summary and Conclusions 216

    7 Inverse Problems in the MEMS/NEMS Applications 219
    Yin Zhang

    7.1 Introduction 219

    7.2 Inverse Problems in the Micro/Nanomechanical Resonators 222

    7.3 Inverse Problems in the MEMS Stiction Test 231

    8 Ohmic RF-MEMS Control 239
    M. Spasos and R. Nilavalan

    8.1 Introduction 239

    8.2 Charge Drive Control (Resistive Damping) 251

    8.3 Hybrid Drive Control 255

    8.4 Control Under High-Pressure Gas Damping 258

    8.5 Comparison between Different Control Modes 258

    9 Dynamics of MEMS Devices 263
    Vamsy Godthi, K. Jayaprakash Reddy and Rudra Pratap

    9.1 Introduction 263

    9.2 Modeling and Simulation 266

    9.3 Fabrication Methods 273

    9.4 Characterization 276

    9.5 Device Failures 280

    10 Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate 285
    Qinghua Wang, Huimin Xie and Yanjie Li

    10.1 Introduction 285

    10.2 Buckling Behaviors of Constantan Wire under Electrical Loading 289

    10.3 Interfacial Toughness between Constantan Wire and Polymer Substrate 305

    10.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire 310

    10.5 Conclusions 321

    11 Microcantilever-Based Nano-Electro-Mechanical Sensor Systems: Characterization, Instrumentation, and Applications 325
    Sheetal Patil and V. Ramgopal Rao

    11.1 Introduction 325

    11.2 Operation Principle and Fundamental Models 327

    11.3 Microcantilever Sensor Fabrication 330

    11.4 Mechanical and Electrical Characterization of Microcantilevers 335

    11.5 Readout Principles 339

    11.6 Application of Microcantilever Sensors 344

    11.7 Energy Harvesting for Sensor Networks 349

    11.8 Conclusion 351

    12 CMOS MEMS Integration 361
    Thejas and Navakanta Bhat

    12.1 Introduction 361

    12.2 State-of-the-Art inertial Sensor 362

    12.3 Capacitance Sensing Techniques 366

    12.4 Capacitance Sensing Architectures 367

    12.5 Continuous Time Voltage Sensing Circuit 368

    12.6 CMOS ASIC Design 371

    12.7 Test Results of CMOS-MEMS Integration 377

    12.8 Electrical Reliability Issues 378

    13 Solving Quality and Reliability Optimization Problems for MEMS with Degradation Data 381
    Yash Lundia, Kunal Jain, Mamanduru Vamsee Krishna, Manoj Kumar Tiwari and Baldev Raj

    13.1 Introduction 382

    13.2 Notations and Assumptions 384

    13.3 Reliability Model 385

    13.4 Numerical Example 395

    13.5 Conclusions 397

    References 397