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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

28.03.2013

Verlag

Springer Us

Seitenzahl

242

Maße (L/B/H)

23,5/15,5/1,5 cm

Gewicht

400 g

Auflage

Softcover reprint of the original 1st ed. 2004

Sprache

Englisch

ISBN

978-1-4757-7934-9

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

28.03.2013

Verlag

Springer Us

Seitenzahl

242

Maße (L/B/H)

23,5/15,5/1,5 cm

Gewicht

400 g

Auflage

Softcover reprint of the original 1st ed. 2004

Sprache

Englisch

ISBN

978-1-4757-7934-9

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: ProductSafety@springernature.com

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  • Produktbild: Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design
  • Produktbild: Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design
  • Preface
    Acknowledgements

    1: Introduction
    1.1. The Deep Sub-Micron IC Design
    1.2. Outline

    2: Preliminaries
    2.1. Overview
    2.2. CMOS Technology
    2.2.1. Transistors
    2.2.2. Gates
    2.2.3. CMOS storage components
    2.2.4. Interconnections
    2.3. IC Design and System-On-a-Chip
    2.3.1. System and constraints
    2.3.2. Design styles
    2.3.3. System-On-a-Chip
    2.4. Design Automation
    2.5. Challenges in the Deep Sub-Micron Era
    2.5.1. The Deep Sub-Micron challenges
    2.5.2. Dealing with the DSM challenges
    2.6. Summary

    3: Circuit Structures
    3.1.Overview
    3.2. Standard-cell
    3.2.1. The structure and usage of the standard-cell
    3.2.2. Existing design methodology for the standard-cell
    3.2.3. An Integrated Standard-cell Physical Design
    3.2.4. Summary of the standard-cell structure
    3.3. PLA
    3.4. Network of PLAs
    3.5. River PLA
    3.5.1. Overview
    3.5.2. The structure of the RPLA
    3.5.3. The design methodology
    3.5.4. Experimental results
    3.5.5. Summary
    3.6. Whirlpool PLA
    3.6.1. The circuit structure of the WPLA
    3.6.2. Doppio-ESPRESSO
    3.6.3. Experimental results
    3.6.4. Summary
    3.7. Checkerboard
    3.7.1. The structure of Checkerboard and its dynamic operation
    3.7.2. The algorithm
    3.7.3. Experimental results
    3.7.4. Summary and discussion
    3.8. Comparison of the Structures

    4: Block Level Placement and Routing
    4.1. Overview
    4.2. The Fishbone Scheme
    4.2.1. An overview of the Fishbone scheme
    4.2.2. The basics of the Fishbone routing
    4.2.3. Interval packing for branches and trunks
    4.2.4. I/O-pins
    4.2.5. The Fishbone placement and routing flow
    4.2.6. Experimental results
    4.2.7. Summary of the Fishbone scheme
    4.3. Fishbone with Buffer Insertion
    4.3.1. The buffers
    4.3.2. Buffer insertion
    4.3.3. The Fishbone-B physical design flow
    4.3.4. Experimental results
    4.3.5. Summary of the Fishbone-B
    4.4. Summary

    5: The Design Flow
    5.1. Overview
    5.2. Basics of the Design Flow
    5.2.1. Modules and paths
    5.2.2. Timing constraints for the modules
    5.2.3. The relation of module area and constraint
    5.2.4. The problems and possible solutions
    5.3. The Physical Synthesis Flow
    5.4. The Module Based Design Flow
    5.4.1. Overview
    5.4.2. The version of soft module
    5.4.3. The physical design stage
    5.4.4. Summary of the Module-Based design flow
    5.5. Comparison of the Two Flows
    5.5. Generation of the testing examples
    5.5.2. The 0.18-micron technology
    5.5.3 The testing circuits
    5.5.4. The comparison
    5.5.5. Case study: A l
    5.6. Summary

    6: Conclusion
    Bibliography
    Index