Structural Dynamics of Electronic and Photonic Systems
Herausgegeben von Suhir, Ephraim; Yu, T. X.; Steinberg, David S.
Structural Dynamics of Electronic and Photonic Systems
Herausgegeben von Suhir, Ephraim; Yu, T. X.; Steinberg, David S.
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The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro and opto electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In depth discussion from a mechanical engineer s viewpoint will be conducted…mehr
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The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro and opto electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In depth discussion from a mechanical engineer s viewpoint will be conducted to the key components' level as well as the whole device level. Both theoretical (analytical and computer aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
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Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Produktdetails
- Produktdetails
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 608
- Erscheinungstermin: 3. Mai 2011
- Englisch
- Abmessung: 241mm x 192mm x 38mm
- Gewicht: 1168g
- ISBN-13: 9780470250020
- ISBN-10: 047025002X
- Artikelnr.: 31187602
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 608
- Erscheinungstermin: 3. Mai 2011
- Englisch
- Abmessung: 241mm x 192mm x 38mm
- Gewicht: 1168g
- ISBN-13: 9780470250020
- ISBN-10: 047025002X
- Artikelnr.: 31187602
Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP (UK), and the SPE. He is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine; cofounder of the ASME Journal of Electronic Packaging ; holds twenty-two U.S. patents; and has authored about 300 technical publications (papers, book chapters, books). Dr. Suhir has received many professional awards, including the 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering; 2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry; 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award; 2000 SPE International Engineering/Technology Award for contributions to plastics engineering; 1999 ASME Charles Russ Richards Memorial Award for contributions to mechanical engineering; and 1996 Bell Laboratories Distinguished Member of Technical Staff Award for developing engineering mechanics methods for predicting the reliability, performance, and mechanical behavior of complex structures. DAVID S. STEINBERG is associated with the University of California, Los Angeles, Extension and also at the University of Wisconsin-Extension. He retired from Litton GCS (now Northrop Grumman) after serving as their director of engineering. He is the author of seven popular textbooks related to the design, analysis, testing, and evaluation of sophisticated electronic equipment for reliable operation in severe vibration, shock, thermal, thermal cycling, acoustic, and pyrotechnic shock environments. His most popular textbooks are Vibration Analysis for Electronic Equipment, Cooling Techniques for Electronic Equipment, and Preventing Thermal Cycling and Vibration Failures in Electronic Equipment, published by Wiley. Dr. Steinberg is currently the President of Steinberg & Associates and has presented seminars, workshops, and consulted for many of the major suppliers of electronics components and equipment such as General Electric, General Motors, Intel, Cisco, Texas Instruments, Microsoft, Harris, Honeywell, Raytheon, Westinghouse, and many others. T. X. YU is Professor Emeritus of Mechanical Engineering at the Hong Kong University of Science and Technology (HKUST). After graduating from Peking University, he got his PhD and ScD from Cambridge University. After teaching at Peking University and UMIST, he joined HKUST in 1995. Before his retirement in July 2010, he was chair professor of mechanical engineering, associate vice-president (R&D), and dean of Fok Ying Tung Graduate School at HKUST. His research interests include impact dynamics, plasticity, energy absorption, textile and cellular materials, and nano-composites. He has published three textbooks, three scientific monographs, 310 journal papers, 170 international conference papers, and four patents. He serves as Associate Editor for the International Journal of Impact Engineering and International Journal of Mechanical Sciences. He is a Fellow of ASME, IMechE, and HKIE.
Preface. Contributors. 1 Some Major Structural Dynamics-Related Failure
Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic
Stability of These Systems (David S. Steinberg). 2 Linear Response to
Shocks and Vibrations (Ephraim Suhir). 3 Linear and Nonlinear Vibrations
Caused by Periodic Impulses (Ephraim Suhir). 4 Random Vibrations of
Structural Elements in Electronic and Photonic Systems (Ephraim Suhir). 5
Natural Frequencies and Failure Mechanisms of Electronic and Photonic
Structures Subjected to Sinusoidal or Random Vibrations (David S.
Steinberg). 6 Drop/Impact of Typical Portable Electronic Devices:
Experimentation and Modeling (T. X. Yu and C. Y. Zhou). 7 Shock Test
Methods and Test Standards for Portable Electronic Devices (C. Y. Zhou, T.
X. Yu, S. W. Ricky Lee, and Ephraim Suhir). 8 Dynamic Response of Solder
Joint Interconnections to Vibration and Shock (David S. Steinberg). 9 Test
Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating
Electronic Equipment (David S. Steinberg). 10 Correlation between
Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical
Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy (Fubin
Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark). 11
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free
Solders in Electronic Packaging (V. B. C. Tan, K. C. Ong, C. T. Lim, and J.
E. Field). 12 Fatigue Damage Evaluation for Microelectronic Components
Subjected to Vibration (T. E. Wong). 13 Vibration Considerations for
Sensitive Research and Production Facilities (E. E. Ungar, H. Amick, and J.
A. Zapfe). 14 Applications of Finite Element Analysis: Attributes and
Challenges (Metin Ozen). 15 Shock Simulation of Drop Test of Hard Disk
Drives (D. W. Shu, B. J. Shi, and J. Luo). 16 Shock Protection of Portable
Electronic Devices Using a "Cushion" of an Array of Wires (AOW) (Ephraim
Suhir). 17 Board-Level Reliability of Lead-Free Solder under Mechanical
Shock and Vibration Loads (Toni T. Matilla, Pekka Marjamaki, and Jorma
Kivilahti). 18 Dynamic Response of PCB Structures to Shock Loading in
Reliability Tests (Milena Vujosevic and Ephraim Suhir). 19 Linear Response
of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests
Adequately Mimic Drop Test Conditions? (Ephraim Suhir). 20 Shock Isolation
of Micromachined Device for High-g Applications (Sang-Hee Yoon, Jin-Eep
Roh, and Ki Lyug Kim). 21 Reliability Assessment of Microelectronics
Packages Using Dynamic Testing Methods (X. Q. Shi, G. Y. Li, and Q. J.
Yang). 22 Thermal Cycle and Vibration/Drop Reliability of Area Array
Package Assemblies (Reza Ghaffarian). 23 Could an Impact Load of Finite
Duration Be Substituted with an Instantaneous Impulse? (Ephraim Suhir and
Luciano Arruda). Index.
Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic
Stability of These Systems (David S. Steinberg). 2 Linear Response to
Shocks and Vibrations (Ephraim Suhir). 3 Linear and Nonlinear Vibrations
Caused by Periodic Impulses (Ephraim Suhir). 4 Random Vibrations of
Structural Elements in Electronic and Photonic Systems (Ephraim Suhir). 5
Natural Frequencies and Failure Mechanisms of Electronic and Photonic
Structures Subjected to Sinusoidal or Random Vibrations (David S.
Steinberg). 6 Drop/Impact of Typical Portable Electronic Devices:
Experimentation and Modeling (T. X. Yu and C. Y. Zhou). 7 Shock Test
Methods and Test Standards for Portable Electronic Devices (C. Y. Zhou, T.
X. Yu, S. W. Ricky Lee, and Ephraim Suhir). 8 Dynamic Response of Solder
Joint Interconnections to Vibration and Shock (David S. Steinberg). 9 Test
Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating
Electronic Equipment (David S. Steinberg). 10 Correlation between
Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical
Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy (Fubin
Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark). 11
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free
Solders in Electronic Packaging (V. B. C. Tan, K. C. Ong, C. T. Lim, and J.
E. Field). 12 Fatigue Damage Evaluation for Microelectronic Components
Subjected to Vibration (T. E. Wong). 13 Vibration Considerations for
Sensitive Research and Production Facilities (E. E. Ungar, H. Amick, and J.
A. Zapfe). 14 Applications of Finite Element Analysis: Attributes and
Challenges (Metin Ozen). 15 Shock Simulation of Drop Test of Hard Disk
Drives (D. W. Shu, B. J. Shi, and J. Luo). 16 Shock Protection of Portable
Electronic Devices Using a "Cushion" of an Array of Wires (AOW) (Ephraim
Suhir). 17 Board-Level Reliability of Lead-Free Solder under Mechanical
Shock and Vibration Loads (Toni T. Matilla, Pekka Marjamaki, and Jorma
Kivilahti). 18 Dynamic Response of PCB Structures to Shock Loading in
Reliability Tests (Milena Vujosevic and Ephraim Suhir). 19 Linear Response
of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests
Adequately Mimic Drop Test Conditions? (Ephraim Suhir). 20 Shock Isolation
of Micromachined Device for High-g Applications (Sang-Hee Yoon, Jin-Eep
Roh, and Ki Lyug Kim). 21 Reliability Assessment of Microelectronics
Packages Using Dynamic Testing Methods (X. Q. Shi, G. Y. Li, and Q. J.
Yang). 22 Thermal Cycle and Vibration/Drop Reliability of Area Array
Package Assemblies (Reza Ghaffarian). 23 Could an Impact Load of Finite
Duration Be Substituted with an Instantaneous Impulse? (Ephraim Suhir and
Luciano Arruda). Index.
Preface. Contributors. 1 Some Major Structural Dynamics-Related Failure
Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic
Stability of These Systems (David S. Steinberg). 2 Linear Response to
Shocks and Vibrations (Ephraim Suhir). 3 Linear and Nonlinear Vibrations
Caused by Periodic Impulses (Ephraim Suhir). 4 Random Vibrations of
Structural Elements in Electronic and Photonic Systems (Ephraim Suhir). 5
Natural Frequencies and Failure Mechanisms of Electronic and Photonic
Structures Subjected to Sinusoidal or Random Vibrations (David S.
Steinberg). 6 Drop/Impact of Typical Portable Electronic Devices:
Experimentation and Modeling (T. X. Yu and C. Y. Zhou). 7 Shock Test
Methods and Test Standards for Portable Electronic Devices (C. Y. Zhou, T.
X. Yu, S. W. Ricky Lee, and Ephraim Suhir). 8 Dynamic Response of Solder
Joint Interconnections to Vibration and Shock (David S. Steinberg). 9 Test
Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating
Electronic Equipment (David S. Steinberg). 10 Correlation between
Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical
Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy (Fubin
Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark). 11
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free
Solders in Electronic Packaging (V. B. C. Tan, K. C. Ong, C. T. Lim, and J.
E. Field). 12 Fatigue Damage Evaluation for Microelectronic Components
Subjected to Vibration (T. E. Wong). 13 Vibration Considerations for
Sensitive Research and Production Facilities (E. E. Ungar, H. Amick, and J.
A. Zapfe). 14 Applications of Finite Element Analysis: Attributes and
Challenges (Metin Ozen). 15 Shock Simulation of Drop Test of Hard Disk
Drives (D. W. Shu, B. J. Shi, and J. Luo). 16 Shock Protection of Portable
Electronic Devices Using a "Cushion" of an Array of Wires (AOW) (Ephraim
Suhir). 17 Board-Level Reliability of Lead-Free Solder under Mechanical
Shock and Vibration Loads (Toni T. Matilla, Pekka Marjamaki, and Jorma
Kivilahti). 18 Dynamic Response of PCB Structures to Shock Loading in
Reliability Tests (Milena Vujosevic and Ephraim Suhir). 19 Linear Response
of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests
Adequately Mimic Drop Test Conditions? (Ephraim Suhir). 20 Shock Isolation
of Micromachined Device for High-g Applications (Sang-Hee Yoon, Jin-Eep
Roh, and Ki Lyug Kim). 21 Reliability Assessment of Microelectronics
Packages Using Dynamic Testing Methods (X. Q. Shi, G. Y. Li, and Q. J.
Yang). 22 Thermal Cycle and Vibration/Drop Reliability of Area Array
Package Assemblies (Reza Ghaffarian). 23 Could an Impact Load of Finite
Duration Be Substituted with an Instantaneous Impulse? (Ephraim Suhir and
Luciano Arruda). Index.
Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic
Stability of These Systems (David S. Steinberg). 2 Linear Response to
Shocks and Vibrations (Ephraim Suhir). 3 Linear and Nonlinear Vibrations
Caused by Periodic Impulses (Ephraim Suhir). 4 Random Vibrations of
Structural Elements in Electronic and Photonic Systems (Ephraim Suhir). 5
Natural Frequencies and Failure Mechanisms of Electronic and Photonic
Structures Subjected to Sinusoidal or Random Vibrations (David S.
Steinberg). 6 Drop/Impact of Typical Portable Electronic Devices:
Experimentation and Modeling (T. X. Yu and C. Y. Zhou). 7 Shock Test
Methods and Test Standards for Portable Electronic Devices (C. Y. Zhou, T.
X. Yu, S. W. Ricky Lee, and Ephraim Suhir). 8 Dynamic Response of Solder
Joint Interconnections to Vibration and Shock (David S. Steinberg). 9 Test
Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating
Electronic Equipment (David S. Steinberg). 10 Correlation between
Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical
Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy (Fubin
Song, S. W. Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark). 11
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free
Solders in Electronic Packaging (V. B. C. Tan, K. C. Ong, C. T. Lim, and J.
E. Field). 12 Fatigue Damage Evaluation for Microelectronic Components
Subjected to Vibration (T. E. Wong). 13 Vibration Considerations for
Sensitive Research and Production Facilities (E. E. Ungar, H. Amick, and J.
A. Zapfe). 14 Applications of Finite Element Analysis: Attributes and
Challenges (Metin Ozen). 15 Shock Simulation of Drop Test of Hard Disk
Drives (D. W. Shu, B. J. Shi, and J. Luo). 16 Shock Protection of Portable
Electronic Devices Using a "Cushion" of an Array of Wires (AOW) (Ephraim
Suhir). 17 Board-Level Reliability of Lead-Free Solder under Mechanical
Shock and Vibration Loads (Toni T. Matilla, Pekka Marjamaki, and Jorma
Kivilahti). 18 Dynamic Response of PCB Structures to Shock Loading in
Reliability Tests (Milena Vujosevic and Ephraim Suhir). 19 Linear Response
of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests
Adequately Mimic Drop Test Conditions? (Ephraim Suhir). 20 Shock Isolation
of Micromachined Device for High-g Applications (Sang-Hee Yoon, Jin-Eep
Roh, and Ki Lyug Kim). 21 Reliability Assessment of Microelectronics
Packages Using Dynamic Testing Methods (X. Q. Shi, G. Y. Li, and Q. J.
Yang). 22 Thermal Cycle and Vibration/Drop Reliability of Area Array
Package Assemblies (Reza Ghaffarian). 23 Could an Impact Load of Finite
Duration Be Substituted with an Instantaneous Impulse? (Ephraim Suhir and
Luciano Arruda). Index.