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Reactive multilayer foils have attracted intense
research attention in recent years, expecially for
their applications as local heat sources in
joining.In this study, reactive multilayer foils are
fabricated by a cold rolling method. Unlike the
generally physical vapor deposited multilayers, the
cold rolled foils possess unique combustion
synthesis behaviors due to their unique structures.
They provide an ideal opportunity to study the
details of the synthesis process in different
reactive multilayer systems.Silicon wafers are
successfully bonded using reactive Ni/Al multilayer
foils as local heat sources. The localized heating
and rapid cooling nature of reactive foil bonding
make this process an ideal method for silicon wafer
bonding and MEMS wafer level packaging
applications.These results should help shed some
light on the development of simple and cost
effective fabrication methods for reactive
multilayer foils, and should be especially useful
for professionals and students in the material
synthesis and MEMS and microelectronics packaging
fields.
research attention in recent years, expecially for
their applications as local heat sources in
joining.In this study, reactive multilayer foils are
fabricated by a cold rolling method. Unlike the
generally physical vapor deposited multilayers, the
cold rolled foils possess unique combustion
synthesis behaviors due to their unique structures.
They provide an ideal opportunity to study the
details of the synthesis process in different
reactive multilayer systems.Silicon wafers are
successfully bonded using reactive Ni/Al multilayer
foils as local heat sources. The localized heating
and rapid cooling nature of reactive foil bonding
make this process an ideal method for silicon wafer
bonding and MEMS wafer level packaging
applications.These results should help shed some
light on the development of simple and cost
effective fabrication methods for reactive
multilayer foils, and should be especially useful
for professionals and students in the material
synthesis and MEMS and microelectronics packaging
fields.