Sheng Liu, Yong Liu
Modeling and Simulation for Microelectronic Packaging Assembly (eBook, PDF)
Manufacturing, Reliability and Testing
Schade – dieser Artikel ist leider ausverkauft. Sobald wir wissen, ob und wann der Artikel wieder verfügbar ist, informieren wir Sie an dieser Stelle.
Sheng Liu, Yong Liu
Modeling and Simulation for Microelectronic Packaging Assembly (eBook, PDF)
Manufacturing, Reliability and Testing
- Format: PDF
- Merkliste
- Auf die Merkliste
- Bewerten Bewerten
- Teilen
- Produkt teilen
- Produkterinnerung
- Produkterinnerung
Bitte loggen Sie sich zunächst in Ihr Kundenkonto ein oder registrieren Sie sich bei
bücher.de, um das eBook-Abo tolino select nutzen zu können.
Hier können Sie sich einloggen
Hier können Sie sich einloggen
Sie sind bereits eingeloggt. Klicken Sie auf 2. tolino select Abo, um fortzufahren.
Bitte loggen Sie sich zunächst in Ihr Kundenkonto ein oder registrieren Sie sich bei bücher.de, um das eBook-Abo tolino select nutzen zu können.
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in…mehr
- Geräte: PC
- eBook Hilfe
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. * Models and simulates numerous processes in manufacturing, reliability and testing for the first time * Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing * Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products * Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects * Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Produktdetails
- Produktdetails
- Verlag: John Wiley & Sons
- Seitenzahl: 592
- Erscheinungstermin: 17. August 2011
- Englisch
- ISBN-13: 9780470827819
- Artikelnr.: 38215146
- Verlag: John Wiley & Sons
- Seitenzahl: 592
- Erscheinungstermin: 17. August 2011
- Englisch
- ISBN-13: 9780470827819
- Artikelnr.: 38215146
Sheng Liu is a ChangJiang Professor of Mechanical Engineering at Huazhong University of Science and Technology. He holds a dual appointment at Wuhan National Laboratory for Optoelectronics, and has served as tenured faculty at Wayne State University. He has over 14 years experience in LED/MEMS/IC packaging and extensive experience in consulting with many leading multi-national and Chinese companies. Liu was awarded the White House/NSF Presidential Faculty Fellowship in 1995, ASME Young Engineer Award in 1996, and China NSFC Overseas Young Scientist in 1999. He is currently one of the 11 National Committee Members in LED under Ministry of Science and Technology. He obtained a Ph.D. from Stanford in 1992, and got MS and BS in flight vehicle design, Nanjing University of Aeronautics and Astronautics, and he had three years industrial experience in China and USA. He has filed more than 70 patents in China and the USA, and has published more than 300 technical articles. Yong Liu is a global team leader of electrical, thermal-mechanical modeling and analysis at Fairchild Semiconductor Corp in South Portland, Maine. His main interest areas are IC packaging, modeling and simulation, reliability and material characterization. He has previously served as Professor at Zhejiang University of Technology, and has worked as an opto package engineer at Nortel Networks in Boston. Liu has co-authored over 100 papers in journals and conferences, has filed over 40 US patents in the area of IC packaging and power device, and has won numerous awards and fellowships in academia and industry: the Fairchild President Award, Fairchild Key Technologist, Fairchild New Product Innovation Award, the Alexander von Humboldt European Fellowship for study at Braunschweig University of Technology and University of Cambridge. Liu holds a PhD from Nanjing University of Science and Technology.
Foreword by C. P. Wong xiii Foreword by Zhigang Suo xv Preface xvii
Acknowledgments xix About the Authors xxi Part I Mechanics and Modeling 1 1
Constitutive Models and Finite Element Method 3 1.1 Constitutive Models for
Typical Materials 3 1.2 Finite Element Method 9 1.3 Chapter Summary 18
References 19 2 Material and Structural Testing for Small Samples 21 2.1
Material Testing for Solder Joints 21 2.2 Scale Effect of Packaging
Materials 32 2.3 Two-Ball Joint Specimen Fatigue Testing 41 2.4 Chapter
Summary 41 References 43 3 Constitutive and User-Supplied Subroutines for
Solders Considering Damage Evolution 45 3.1 Constitutive Model for Tin-Lead
Solder Joint 45 3.2 Visco-Elastic-Plastic Properties and Constitutive
Modeling of Underfills 50 3.3 A Damage Coupling Framework of Unified
Viscoplasticity for the Fatigue of Solder Alloys 56 3.4 User-Supplied
Subroutines for Solders Considering Damage Evolution 67 3.5 Chapter Summary
76 References 76 4 Accelerated Fatigue Life Assessment Approaches for
Solders in Packages 79 4.1 Life Prediction Methodology 79 4.2 Accelerated
Testing Methodology 82 4.3 Constitutive Modeling Methodology 83 4.4 Solder
Joint Reliability via FEA 84 4.5 Life Prediction of Flip-Chip Packages 93
4.6 Chapter Summary 99 References 99 5 Multi-Physics and Multi-Scale
Modeling 103 5.1 Multi-Physics Modeling 103 5.2 Multi-Scale Modeling 106
5.3 Chapter Summary 107 References 108 6 Modeling Validation Tools 109 6.1
Structural Mechanics Analysis 109 6.2 Requirements of Experimental Methods
for Structural Mechanics Analysis 111 6.3 Whole Field Optical Techniques
112 6.4 Thermal Strains Measurements Using Moire Interferometry 113 6.5
In-Situ Measurements on Micro-Machined Sensors 116 6.6 Real-Time
Measurements Using Speckle Interferometry 119 6.7 Image Processing and
Computer Aided Optical Techniques 120 6.8 Real-Time Thermal-Mechanical
Loading Tools 123 6.9 Warpage Measurement Using PM-SM System 124 6.10
Chapter Summary 131 References 131 7 Application of Fracture Mechanics 135
7.1 Fundamental of Fracture Mechanics 135 7.2 Bulk Material Cracks in
Electronic Packages 141 7.3 Interfacial Fracture Toughness 148 7.4
Three-Dimensional Energy Release Rate Calculation 159 7.5 Chapter Summary
165 References 165 8 Concurrent Engineering for Microelectronics 169 8.1
Design Optimization 169 8.2 New Developments and Trends in Integrated
Design Tools 179 8.3 Chapter Summary 183 References 183 Part II Modeling in
Microelectronic Packaging and Assembly 185 9 Typical IC Packaging and
Assembly Processes 187 9.1 Wafer Process and Thinning 188 9.2 Die Pick Up
193 9.3 Die Attach 198 9.4 Wire Bonding 206 9.5 Molding 223 9.6 Leadframe
Forming/Singulation 241 9.7 Chapter Summary 252 References 252 10 Opto
Packaging and Assembly 255 10.1 Silicon Substrate Based Opto Package
Assembly 255 10.2 Welding of a Pump Laser Module 258 10.3 Chapter Summary
264 References 264 11 MEMS and MEMS Package Assembly 267 11.1 A Pressure
Sensor Packaging (Deformation and Stress) 267 11.2 Mounting of Pressure
Sensor 273 11.3 Thermo-Fluid Based Accelerometer Packaging 279 11.4 Plastic
Packaging for a Capacitance Based Accelerometer 288 11.5 Tire Pressure
Monitoring System (TPMS) Antenna 303 11.6 Thermo-Fluid Based Gyroscope
Packaging 310 11.7 Microjets for Radar and LED Cooling 316 11.8 Air Flow
Sensor 327 11.9 Direct Numerical Simulation of Particle Separation by
Direct Current Dielectrophoresis 335 11.10 Modeling of Micro-Machine for
Use in Gastrointestinal Endoscopy 341 11.11 Chapter Summary 353 References
354 12 System in Package (SIP) Assembly 361 12.1 Assembly Process of Side
by Side Placed SIP 361 12.2 Impact of the Nonlinear Materials Behaviors on
the Flip-Chip Packaging Assembly Reliability 369 12.3 Stacked Die Flip-Chip
Assembly Layout and the Material Selection 381 12.4 Chapter Summary 393
References 393 Part III Modeling in Microelectronic Package Reliability and
Test 395 13 Wafer Probing Test 397 13.1 Probe Test Model 397 13.2 Parameter
Probe Test Modeling Results and Discussions 400 13.3 Comparison Modeling:
Probe Test versus Wire Bonding 406 13.4 Design of Experiment (DOE) Study
and Correlation of Probing Experiment and FEA Modeling 409 13.5 Chapter
Summary 411 References 412 14 Power and Thermal Cycling, Solder Joint
Fatigue Life 413 14.1 Die Attach Process and Material Relations 413 14.2
Power Cycling Modeling and Discussion 413 14.3 Thermal Cycling Modeling and
Discussion 420 14.4 Methodology of Solder Joint Fatigue Life Prediction 426
14.5 Fatigue Life Prediction of a Stack Die Flip-Chip on Silicon (FSBGA)
427 14.6 Effect of Cleaned and Non-Cleaned Situations on the Reliability of
Flip-Chip Packages 434 14.7 Chapter Summary 438 References 439 15
Passivation Crack Avoidance 441 15.1 Ratcheting-Induced Stable Cracking: A
Synopsis 441 15.2 Ratcheting in Metal Films 445 15.3 Cracking in
Passivation Films 447 15.4 Design Modifications 452 15.5 Chapter Summary
452 References 452 16 Drop Test 453 16.1 Controlled Pulse Drop Test 453
16.2 Free Drop 460 16.3 Portable Electronic Devices Drop Test and
Simulation 467 16.4 Chapter Summary 470 References 471 17 Electromigration
473 17.1 Basic Migration Formulation and Algorithm 473 17.2
Electromigration Examples from IC Device and Package 477 17.3 Chapter
Summary 496 References 497 18 Popcorning in Plastic Packages 499 18.1
Statement of Problem 499 18.2 Analysis 501 18.3 Results and Comparisons 503
18.4 Chapter Summary 515 References 516 Part IV Modern Modeling and
Simulation Methodologies: Application to Nano Packaging 519 19 Classical
Molecular Dynamics 521 19.1 General Description of Molecular Dynamics
Method 521 19.2 Mechanism of Carbon Nanotube Welding onto the Metal 522
19.3 Applications of Car-Parrinello Molecular Dynamics 530 19.4
Nano-Welding by RF Heating 544 19.5 Chapter Summary 548 References 548
Index 553
Acknowledgments xix About the Authors xxi Part I Mechanics and Modeling 1 1
Constitutive Models and Finite Element Method 3 1.1 Constitutive Models for
Typical Materials 3 1.2 Finite Element Method 9 1.3 Chapter Summary 18
References 19 2 Material and Structural Testing for Small Samples 21 2.1
Material Testing for Solder Joints 21 2.2 Scale Effect of Packaging
Materials 32 2.3 Two-Ball Joint Specimen Fatigue Testing 41 2.4 Chapter
Summary 41 References 43 3 Constitutive and User-Supplied Subroutines for
Solders Considering Damage Evolution 45 3.1 Constitutive Model for Tin-Lead
Solder Joint 45 3.2 Visco-Elastic-Plastic Properties and Constitutive
Modeling of Underfills 50 3.3 A Damage Coupling Framework of Unified
Viscoplasticity for the Fatigue of Solder Alloys 56 3.4 User-Supplied
Subroutines for Solders Considering Damage Evolution 67 3.5 Chapter Summary
76 References 76 4 Accelerated Fatigue Life Assessment Approaches for
Solders in Packages 79 4.1 Life Prediction Methodology 79 4.2 Accelerated
Testing Methodology 82 4.3 Constitutive Modeling Methodology 83 4.4 Solder
Joint Reliability via FEA 84 4.5 Life Prediction of Flip-Chip Packages 93
4.6 Chapter Summary 99 References 99 5 Multi-Physics and Multi-Scale
Modeling 103 5.1 Multi-Physics Modeling 103 5.2 Multi-Scale Modeling 106
5.3 Chapter Summary 107 References 108 6 Modeling Validation Tools 109 6.1
Structural Mechanics Analysis 109 6.2 Requirements of Experimental Methods
for Structural Mechanics Analysis 111 6.3 Whole Field Optical Techniques
112 6.4 Thermal Strains Measurements Using Moire Interferometry 113 6.5
In-Situ Measurements on Micro-Machined Sensors 116 6.6 Real-Time
Measurements Using Speckle Interferometry 119 6.7 Image Processing and
Computer Aided Optical Techniques 120 6.8 Real-Time Thermal-Mechanical
Loading Tools 123 6.9 Warpage Measurement Using PM-SM System 124 6.10
Chapter Summary 131 References 131 7 Application of Fracture Mechanics 135
7.1 Fundamental of Fracture Mechanics 135 7.2 Bulk Material Cracks in
Electronic Packages 141 7.3 Interfacial Fracture Toughness 148 7.4
Three-Dimensional Energy Release Rate Calculation 159 7.5 Chapter Summary
165 References 165 8 Concurrent Engineering for Microelectronics 169 8.1
Design Optimization 169 8.2 New Developments and Trends in Integrated
Design Tools 179 8.3 Chapter Summary 183 References 183 Part II Modeling in
Microelectronic Packaging and Assembly 185 9 Typical IC Packaging and
Assembly Processes 187 9.1 Wafer Process and Thinning 188 9.2 Die Pick Up
193 9.3 Die Attach 198 9.4 Wire Bonding 206 9.5 Molding 223 9.6 Leadframe
Forming/Singulation 241 9.7 Chapter Summary 252 References 252 10 Opto
Packaging and Assembly 255 10.1 Silicon Substrate Based Opto Package
Assembly 255 10.2 Welding of a Pump Laser Module 258 10.3 Chapter Summary
264 References 264 11 MEMS and MEMS Package Assembly 267 11.1 A Pressure
Sensor Packaging (Deformation and Stress) 267 11.2 Mounting of Pressure
Sensor 273 11.3 Thermo-Fluid Based Accelerometer Packaging 279 11.4 Plastic
Packaging for a Capacitance Based Accelerometer 288 11.5 Tire Pressure
Monitoring System (TPMS) Antenna 303 11.6 Thermo-Fluid Based Gyroscope
Packaging 310 11.7 Microjets for Radar and LED Cooling 316 11.8 Air Flow
Sensor 327 11.9 Direct Numerical Simulation of Particle Separation by
Direct Current Dielectrophoresis 335 11.10 Modeling of Micro-Machine for
Use in Gastrointestinal Endoscopy 341 11.11 Chapter Summary 353 References
354 12 System in Package (SIP) Assembly 361 12.1 Assembly Process of Side
by Side Placed SIP 361 12.2 Impact of the Nonlinear Materials Behaviors on
the Flip-Chip Packaging Assembly Reliability 369 12.3 Stacked Die Flip-Chip
Assembly Layout and the Material Selection 381 12.4 Chapter Summary 393
References 393 Part III Modeling in Microelectronic Package Reliability and
Test 395 13 Wafer Probing Test 397 13.1 Probe Test Model 397 13.2 Parameter
Probe Test Modeling Results and Discussions 400 13.3 Comparison Modeling:
Probe Test versus Wire Bonding 406 13.4 Design of Experiment (DOE) Study
and Correlation of Probing Experiment and FEA Modeling 409 13.5 Chapter
Summary 411 References 412 14 Power and Thermal Cycling, Solder Joint
Fatigue Life 413 14.1 Die Attach Process and Material Relations 413 14.2
Power Cycling Modeling and Discussion 413 14.3 Thermal Cycling Modeling and
Discussion 420 14.4 Methodology of Solder Joint Fatigue Life Prediction 426
14.5 Fatigue Life Prediction of a Stack Die Flip-Chip on Silicon (FSBGA)
427 14.6 Effect of Cleaned and Non-Cleaned Situations on the Reliability of
Flip-Chip Packages 434 14.7 Chapter Summary 438 References 439 15
Passivation Crack Avoidance 441 15.1 Ratcheting-Induced Stable Cracking: A
Synopsis 441 15.2 Ratcheting in Metal Films 445 15.3 Cracking in
Passivation Films 447 15.4 Design Modifications 452 15.5 Chapter Summary
452 References 452 16 Drop Test 453 16.1 Controlled Pulse Drop Test 453
16.2 Free Drop 460 16.3 Portable Electronic Devices Drop Test and
Simulation 467 16.4 Chapter Summary 470 References 471 17 Electromigration
473 17.1 Basic Migration Formulation and Algorithm 473 17.2
Electromigration Examples from IC Device and Package 477 17.3 Chapter
Summary 496 References 497 18 Popcorning in Plastic Packages 499 18.1
Statement of Problem 499 18.2 Analysis 501 18.3 Results and Comparisons 503
18.4 Chapter Summary 515 References 516 Part IV Modern Modeling and
Simulation Methodologies: Application to Nano Packaging 519 19 Classical
Molecular Dynamics 521 19.1 General Description of Molecular Dynamics
Method 521 19.2 Mechanism of Carbon Nanotube Welding onto the Metal 522
19.3 Applications of Car-Parrinello Molecular Dynamics 530 19.4
Nano-Welding by RF Heating 544 19.5 Chapter Summary 548 References 548
Index 553
Foreword by C. P. Wong xiii Foreword by Zhigang Suo xv Preface xvii
Acknowledgments xix About the Authors xxi Part I Mechanics and Modeling 1 1
Constitutive Models and Finite Element Method 3 1.1 Constitutive Models for
Typical Materials 3 1.2 Finite Element Method 9 1.3 Chapter Summary 18
References 19 2 Material and Structural Testing for Small Samples 21 2.1
Material Testing for Solder Joints 21 2.2 Scale Effect of Packaging
Materials 32 2.3 Two-Ball Joint Specimen Fatigue Testing 41 2.4 Chapter
Summary 41 References 43 3 Constitutive and User-Supplied Subroutines for
Solders Considering Damage Evolution 45 3.1 Constitutive Model for Tin-Lead
Solder Joint 45 3.2 Visco-Elastic-Plastic Properties and Constitutive
Modeling of Underfills 50 3.3 A Damage Coupling Framework of Unified
Viscoplasticity for the Fatigue of Solder Alloys 56 3.4 User-Supplied
Subroutines for Solders Considering Damage Evolution 67 3.5 Chapter Summary
76 References 76 4 Accelerated Fatigue Life Assessment Approaches for
Solders in Packages 79 4.1 Life Prediction Methodology 79 4.2 Accelerated
Testing Methodology 82 4.3 Constitutive Modeling Methodology 83 4.4 Solder
Joint Reliability via FEA 84 4.5 Life Prediction of Flip-Chip Packages 93
4.6 Chapter Summary 99 References 99 5 Multi-Physics and Multi-Scale
Modeling 103 5.1 Multi-Physics Modeling 103 5.2 Multi-Scale Modeling 106
5.3 Chapter Summary 107 References 108 6 Modeling Validation Tools 109 6.1
Structural Mechanics Analysis 109 6.2 Requirements of Experimental Methods
for Structural Mechanics Analysis 111 6.3 Whole Field Optical Techniques
112 6.4 Thermal Strains Measurements Using Moire Interferometry 113 6.5
In-Situ Measurements on Micro-Machined Sensors 116 6.6 Real-Time
Measurements Using Speckle Interferometry 119 6.7 Image Processing and
Computer Aided Optical Techniques 120 6.8 Real-Time Thermal-Mechanical
Loading Tools 123 6.9 Warpage Measurement Using PM-SM System 124 6.10
Chapter Summary 131 References 131 7 Application of Fracture Mechanics 135
7.1 Fundamental of Fracture Mechanics 135 7.2 Bulk Material Cracks in
Electronic Packages 141 7.3 Interfacial Fracture Toughness 148 7.4
Three-Dimensional Energy Release Rate Calculation 159 7.5 Chapter Summary
165 References 165 8 Concurrent Engineering for Microelectronics 169 8.1
Design Optimization 169 8.2 New Developments and Trends in Integrated
Design Tools 179 8.3 Chapter Summary 183 References 183 Part II Modeling in
Microelectronic Packaging and Assembly 185 9 Typical IC Packaging and
Assembly Processes 187 9.1 Wafer Process and Thinning 188 9.2 Die Pick Up
193 9.3 Die Attach 198 9.4 Wire Bonding 206 9.5 Molding 223 9.6 Leadframe
Forming/Singulation 241 9.7 Chapter Summary 252 References 252 10 Opto
Packaging and Assembly 255 10.1 Silicon Substrate Based Opto Package
Assembly 255 10.2 Welding of a Pump Laser Module 258 10.3 Chapter Summary
264 References 264 11 MEMS and MEMS Package Assembly 267 11.1 A Pressure
Sensor Packaging (Deformation and Stress) 267 11.2 Mounting of Pressure
Sensor 273 11.3 Thermo-Fluid Based Accelerometer Packaging 279 11.4 Plastic
Packaging for a Capacitance Based Accelerometer 288 11.5 Tire Pressure
Monitoring System (TPMS) Antenna 303 11.6 Thermo-Fluid Based Gyroscope
Packaging 310 11.7 Microjets for Radar and LED Cooling 316 11.8 Air Flow
Sensor 327 11.9 Direct Numerical Simulation of Particle Separation by
Direct Current Dielectrophoresis 335 11.10 Modeling of Micro-Machine for
Use in Gastrointestinal Endoscopy 341 11.11 Chapter Summary 353 References
354 12 System in Package (SIP) Assembly 361 12.1 Assembly Process of Side
by Side Placed SIP 361 12.2 Impact of the Nonlinear Materials Behaviors on
the Flip-Chip Packaging Assembly Reliability 369 12.3 Stacked Die Flip-Chip
Assembly Layout and the Material Selection 381 12.4 Chapter Summary 393
References 393 Part III Modeling in Microelectronic Package Reliability and
Test 395 13 Wafer Probing Test 397 13.1 Probe Test Model 397 13.2 Parameter
Probe Test Modeling Results and Discussions 400 13.3 Comparison Modeling:
Probe Test versus Wire Bonding 406 13.4 Design of Experiment (DOE) Study
and Correlation of Probing Experiment and FEA Modeling 409 13.5 Chapter
Summary 411 References 412 14 Power and Thermal Cycling, Solder Joint
Fatigue Life 413 14.1 Die Attach Process and Material Relations 413 14.2
Power Cycling Modeling and Discussion 413 14.3 Thermal Cycling Modeling and
Discussion 420 14.4 Methodology of Solder Joint Fatigue Life Prediction 426
14.5 Fatigue Life Prediction of a Stack Die Flip-Chip on Silicon (FSBGA)
427 14.6 Effect of Cleaned and Non-Cleaned Situations on the Reliability of
Flip-Chip Packages 434 14.7 Chapter Summary 438 References 439 15
Passivation Crack Avoidance 441 15.1 Ratcheting-Induced Stable Cracking: A
Synopsis 441 15.2 Ratcheting in Metal Films 445 15.3 Cracking in
Passivation Films 447 15.4 Design Modifications 452 15.5 Chapter Summary
452 References 452 16 Drop Test 453 16.1 Controlled Pulse Drop Test 453
16.2 Free Drop 460 16.3 Portable Electronic Devices Drop Test and
Simulation 467 16.4 Chapter Summary 470 References 471 17 Electromigration
473 17.1 Basic Migration Formulation and Algorithm 473 17.2
Electromigration Examples from IC Device and Package 477 17.3 Chapter
Summary 496 References 497 18 Popcorning in Plastic Packages 499 18.1
Statement of Problem 499 18.2 Analysis 501 18.3 Results and Comparisons 503
18.4 Chapter Summary 515 References 516 Part IV Modern Modeling and
Simulation Methodologies: Application to Nano Packaging 519 19 Classical
Molecular Dynamics 521 19.1 General Description of Molecular Dynamics
Method 521 19.2 Mechanism of Carbon Nanotube Welding onto the Metal 522
19.3 Applications of Car-Parrinello Molecular Dynamics 530 19.4
Nano-Welding by RF Heating 544 19.5 Chapter Summary 548 References 548
Index 553
Acknowledgments xix About the Authors xxi Part I Mechanics and Modeling 1 1
Constitutive Models and Finite Element Method 3 1.1 Constitutive Models for
Typical Materials 3 1.2 Finite Element Method 9 1.3 Chapter Summary 18
References 19 2 Material and Structural Testing for Small Samples 21 2.1
Material Testing for Solder Joints 21 2.2 Scale Effect of Packaging
Materials 32 2.3 Two-Ball Joint Specimen Fatigue Testing 41 2.4 Chapter
Summary 41 References 43 3 Constitutive and User-Supplied Subroutines for
Solders Considering Damage Evolution 45 3.1 Constitutive Model for Tin-Lead
Solder Joint 45 3.2 Visco-Elastic-Plastic Properties and Constitutive
Modeling of Underfills 50 3.3 A Damage Coupling Framework of Unified
Viscoplasticity for the Fatigue of Solder Alloys 56 3.4 User-Supplied
Subroutines for Solders Considering Damage Evolution 67 3.5 Chapter Summary
76 References 76 4 Accelerated Fatigue Life Assessment Approaches for
Solders in Packages 79 4.1 Life Prediction Methodology 79 4.2 Accelerated
Testing Methodology 82 4.3 Constitutive Modeling Methodology 83 4.4 Solder
Joint Reliability via FEA 84 4.5 Life Prediction of Flip-Chip Packages 93
4.6 Chapter Summary 99 References 99 5 Multi-Physics and Multi-Scale
Modeling 103 5.1 Multi-Physics Modeling 103 5.2 Multi-Scale Modeling 106
5.3 Chapter Summary 107 References 108 6 Modeling Validation Tools 109 6.1
Structural Mechanics Analysis 109 6.2 Requirements of Experimental Methods
for Structural Mechanics Analysis 111 6.3 Whole Field Optical Techniques
112 6.4 Thermal Strains Measurements Using Moire Interferometry 113 6.5
In-Situ Measurements on Micro-Machined Sensors 116 6.6 Real-Time
Measurements Using Speckle Interferometry 119 6.7 Image Processing and
Computer Aided Optical Techniques 120 6.8 Real-Time Thermal-Mechanical
Loading Tools 123 6.9 Warpage Measurement Using PM-SM System 124 6.10
Chapter Summary 131 References 131 7 Application of Fracture Mechanics 135
7.1 Fundamental of Fracture Mechanics 135 7.2 Bulk Material Cracks in
Electronic Packages 141 7.3 Interfacial Fracture Toughness 148 7.4
Three-Dimensional Energy Release Rate Calculation 159 7.5 Chapter Summary
165 References 165 8 Concurrent Engineering for Microelectronics 169 8.1
Design Optimization 169 8.2 New Developments and Trends in Integrated
Design Tools 179 8.3 Chapter Summary 183 References 183 Part II Modeling in
Microelectronic Packaging and Assembly 185 9 Typical IC Packaging and
Assembly Processes 187 9.1 Wafer Process and Thinning 188 9.2 Die Pick Up
193 9.3 Die Attach 198 9.4 Wire Bonding 206 9.5 Molding 223 9.6 Leadframe
Forming/Singulation 241 9.7 Chapter Summary 252 References 252 10 Opto
Packaging and Assembly 255 10.1 Silicon Substrate Based Opto Package
Assembly 255 10.2 Welding of a Pump Laser Module 258 10.3 Chapter Summary
264 References 264 11 MEMS and MEMS Package Assembly 267 11.1 A Pressure
Sensor Packaging (Deformation and Stress) 267 11.2 Mounting of Pressure
Sensor 273 11.3 Thermo-Fluid Based Accelerometer Packaging 279 11.4 Plastic
Packaging for a Capacitance Based Accelerometer 288 11.5 Tire Pressure
Monitoring System (TPMS) Antenna 303 11.6 Thermo-Fluid Based Gyroscope
Packaging 310 11.7 Microjets for Radar and LED Cooling 316 11.8 Air Flow
Sensor 327 11.9 Direct Numerical Simulation of Particle Separation by
Direct Current Dielectrophoresis 335 11.10 Modeling of Micro-Machine for
Use in Gastrointestinal Endoscopy 341 11.11 Chapter Summary 353 References
354 12 System in Package (SIP) Assembly 361 12.1 Assembly Process of Side
by Side Placed SIP 361 12.2 Impact of the Nonlinear Materials Behaviors on
the Flip-Chip Packaging Assembly Reliability 369 12.3 Stacked Die Flip-Chip
Assembly Layout and the Material Selection 381 12.4 Chapter Summary 393
References 393 Part III Modeling in Microelectronic Package Reliability and
Test 395 13 Wafer Probing Test 397 13.1 Probe Test Model 397 13.2 Parameter
Probe Test Modeling Results and Discussions 400 13.3 Comparison Modeling:
Probe Test versus Wire Bonding 406 13.4 Design of Experiment (DOE) Study
and Correlation of Probing Experiment and FEA Modeling 409 13.5 Chapter
Summary 411 References 412 14 Power and Thermal Cycling, Solder Joint
Fatigue Life 413 14.1 Die Attach Process and Material Relations 413 14.2
Power Cycling Modeling and Discussion 413 14.3 Thermal Cycling Modeling and
Discussion 420 14.4 Methodology of Solder Joint Fatigue Life Prediction 426
14.5 Fatigue Life Prediction of a Stack Die Flip-Chip on Silicon (FSBGA)
427 14.6 Effect of Cleaned and Non-Cleaned Situations on the Reliability of
Flip-Chip Packages 434 14.7 Chapter Summary 438 References 439 15
Passivation Crack Avoidance 441 15.1 Ratcheting-Induced Stable Cracking: A
Synopsis 441 15.2 Ratcheting in Metal Films 445 15.3 Cracking in
Passivation Films 447 15.4 Design Modifications 452 15.5 Chapter Summary
452 References 452 16 Drop Test 453 16.1 Controlled Pulse Drop Test 453
16.2 Free Drop 460 16.3 Portable Electronic Devices Drop Test and
Simulation 467 16.4 Chapter Summary 470 References 471 17 Electromigration
473 17.1 Basic Migration Formulation and Algorithm 473 17.2
Electromigration Examples from IC Device and Package 477 17.3 Chapter
Summary 496 References 497 18 Popcorning in Plastic Packages 499 18.1
Statement of Problem 499 18.2 Analysis 501 18.3 Results and Comparisons 503
18.4 Chapter Summary 515 References 516 Part IV Modern Modeling and
Simulation Methodologies: Application to Nano Packaging 519 19 Classical
Molecular Dynamics 521 19.1 General Description of Molecular Dynamics
Method 521 19.2 Mechanism of Carbon Nanotube Welding onto the Metal 522
19.3 Applications of Car-Parrinello Molecular Dynamics 530 19.4
Nano-Welding by RF Heating 544 19.5 Chapter Summary 548 References 548
Index 553