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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers)…mehr
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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
Various theories or mechanisms of adhesion
Surface (physical or chemical) characterization of materials as it pertains to adhesion
Surface cleaning as it pertains to adhesion
Ways to improve adhesion
Unraveling of interfacial interactions using an array of pertinent techniques
Characterization of interfaces / interphases
Polymer-polymer adhesion
Metal-polymer adhesion (metallized polymers)
Polymer adhesion to various substrates
Adhesion of thin films
Adhesion of underfills
Adhesion of molding compounds
Adhesion of different dielectric materials
Delamination and reliability issues in packaged devices
Interface mechanics and crack propagation
Adhesion measurement of thin films and coatings
Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Various theories or mechanisms of adhesion
Surface (physical or chemical) characterization of materials as it pertains to adhesion
Surface cleaning as it pertains to adhesion
Ways to improve adhesion
Unraveling of interfacial interactions using an array of pertinent techniques
Characterization of interfaces / interphases
Polymer-polymer adhesion
Metal-polymer adhesion (metallized polymers)
Polymer adhesion to various substrates
Adhesion of thin films
Adhesion of underfills
Adhesion of molding compounds
Adhesion of different dielectric materials
Delamination and reliability issues in packaged devices
Interface mechanics and crack propagation
Adhesion measurement of thin films and coatings
Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Produktdetails
- Produktdetails
- Adhesion and Adhesives - Fundamental and Applied Aspects
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 368
- Erscheinungstermin: 22. September 2014
- Englisch
- Abmessung: 236mm x 155mm x 25mm
- Gewicht: 635g
- ISBN-13: 9781118831335
- ISBN-10: 1118831330
- Artikelnr.: 40046243
- Adhesion and Adhesives - Fundamental and Applied Aspects
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 368
- Erscheinungstermin: 22. September 2014
- Englisch
- Abmessung: 236mm x 155mm x 25mm
- Gewicht: 635g
- ISBN-13: 9781118831335
- ISBN-10: 1118831330
- Artikelnr.: 40046243
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Sk?odowska University, Lublin, Poland. He is the editor of more than 110 volumes dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives. Tanweer Ahsan is a scientist engineer at Henkel Electronic Materials LLC in Irvine, California.
Preface xiii Acknowledgements xvi Part 1: Adhesion: Fundamentals and
Measurement 1 Study of Molecular Bonding or Adhesion by Inelastic Electron
Tunneling Spectroscopy, with Special Reference to Microelectronics 3 Robert
R. Mallik 1.1 Introduction 3 1.2 Principles of IETS 6 1.3 Application of
IETS in Microelectronics 13 1.4 Prospects 24 1.5 Summary 26 References 27 2
Adhesion Measurement of Thin Films and Coatings: Relevance to
Microelectronics 33 Wei-Sheng Lei and Ajay Kumar 2.1 Introduction 33 2.2
Mechanical Methods 36 2.3 Laser Based Techniques 51 2.4 Summary and Remarks
56 References 59 Part 2: Ways to Promote/Enhance Adhesion 3 Tailoring of
Interface/Interphase to Promote Metal-Polymer Adhesion 67 Jörg Friedrich
3.1 Introduction 67 3.2 New Concepts for Ideal Design of Metal-Polymer
Interfaces with Covalently Bonded Flexible Spacer Molecules 87 3.3
Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate 92
3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin
Surfaces 94 3.5 Methods for Producing Monosort Functional Groups at
Polyolefin Surfaces 103 3.6 Reactions and Bond Formation at the Interface
110 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces 112 3.8 Summary
and Conclusions 121 Acknowledgement 123 References 123 4 Atmospheric and
Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in
Microelectronics Packaging 137 Hang Yu, Yiyuan Zhang, Anita Wong, Igor M.
De Rosa, Han S. Chueh, Misha Grigoriev, Thomas S. Williams, Tommy Hsu, and
Robert F. Hicks 4.1 Introduction 137 4.2 Plasma Fundamentals 139 4.3 Survey
of Vacuum Plasma Treatment of Polymers 146 4.4 Survey of Atmospheric
Pressure Plasma Treatment of Polymers 151 4.5 Atmospheric Pressure Plasma
Activation of Polymer Materials Relevant to Microelectronics 153 4.6 Vacuum
Versus Atmospheric Plasmas for Use in Semiconductor Packaging 165
References 166 5 Isotropic Conductive Adhesive Interconnect Technology in
Electronics Packaging Applications 173 James E. Morris and Liang Wang 5.1
Introduction 173 5.2 ICA Technology 174 5.3 Technology Reviews 176 5.4
Electrical Properties 176 5.5 Mechanical Properties 180 5.6 Thermal
Properties 181 5.7 Metallic Filler 181 5.8 Polymer Materials 184 5.9
Reliability 186 5.10 Dispensation 188 5.11 Environmental Properties 189
5.12 Other Results 189 5.13 Summary 190 5.14 Prospects 190 References 191
Part 3: Reliability and Failure Mechanisms 6 Role of Adhesion Phenomenon in
the Reliability of Electronic Packaging 213 Puligandla Viswanadham 6.1
Introduction 214 6.2 Hierarchy of Electronic Packaging. 216 6.3 Substrates,
Carriers, and Laminates 217 6.4 Flexible Laminates 236 6.5 First Level
Packaging /Semiconductor Packaging 237 6.6 Second Level Packaging 247 6.7
Reliability Enhancements 256 6.8 Thermal Management 260 6.9 Summary 261
Acknowledgements 262 References 252 Suggested Reading 262 References 262 7
Delamination and Reliability Issues in Packaged Devices 267 Wei-Sheng Lei
and Ajay Kumar 7.1 Introduction 267 7.2 Basic Aspects of Delamination
Failure 269 7.3 Evaluation of Delamination Initiation in Electronic
Packages 280 7.4 Evaluation of Delamination Propagation in Electronic
Packages 290 7.5 Summary 304 References 305 8 Investigation of the
Mechanisms of Adhesion and Failure in Microelectronic Packages 313 Tanweer
Ahsan and Andrew Schoenberg 8.1 Introduction 313 8.2 Thermal Methods of
Characterizatio 314 8.3 Stresses in Encapsulated Devices 320 8.4 More on
Adhesion of Molding Compounds - Surface Chemical and Morphological Aspects
332 8.5 Summary 337 References 338
Measurement 1 Study of Molecular Bonding or Adhesion by Inelastic Electron
Tunneling Spectroscopy, with Special Reference to Microelectronics 3 Robert
R. Mallik 1.1 Introduction 3 1.2 Principles of IETS 6 1.3 Application of
IETS in Microelectronics 13 1.4 Prospects 24 1.5 Summary 26 References 27 2
Adhesion Measurement of Thin Films and Coatings: Relevance to
Microelectronics 33 Wei-Sheng Lei and Ajay Kumar 2.1 Introduction 33 2.2
Mechanical Methods 36 2.3 Laser Based Techniques 51 2.4 Summary and Remarks
56 References 59 Part 2: Ways to Promote/Enhance Adhesion 3 Tailoring of
Interface/Interphase to Promote Metal-Polymer Adhesion 67 Jörg Friedrich
3.1 Introduction 67 3.2 New Concepts for Ideal Design of Metal-Polymer
Interfaces with Covalently Bonded Flexible Spacer Molecules 87 3.3
Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate 92
3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin
Surfaces 94 3.5 Methods for Producing Monosort Functional Groups at
Polyolefin Surfaces 103 3.6 Reactions and Bond Formation at the Interface
110 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces 112 3.8 Summary
and Conclusions 121 Acknowledgement 123 References 123 4 Atmospheric and
Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in
Microelectronics Packaging 137 Hang Yu, Yiyuan Zhang, Anita Wong, Igor M.
De Rosa, Han S. Chueh, Misha Grigoriev, Thomas S. Williams, Tommy Hsu, and
Robert F. Hicks 4.1 Introduction 137 4.2 Plasma Fundamentals 139 4.3 Survey
of Vacuum Plasma Treatment of Polymers 146 4.4 Survey of Atmospheric
Pressure Plasma Treatment of Polymers 151 4.5 Atmospheric Pressure Plasma
Activation of Polymer Materials Relevant to Microelectronics 153 4.6 Vacuum
Versus Atmospheric Plasmas for Use in Semiconductor Packaging 165
References 166 5 Isotropic Conductive Adhesive Interconnect Technology in
Electronics Packaging Applications 173 James E. Morris and Liang Wang 5.1
Introduction 173 5.2 ICA Technology 174 5.3 Technology Reviews 176 5.4
Electrical Properties 176 5.5 Mechanical Properties 180 5.6 Thermal
Properties 181 5.7 Metallic Filler 181 5.8 Polymer Materials 184 5.9
Reliability 186 5.10 Dispensation 188 5.11 Environmental Properties 189
5.12 Other Results 189 5.13 Summary 190 5.14 Prospects 190 References 191
Part 3: Reliability and Failure Mechanisms 6 Role of Adhesion Phenomenon in
the Reliability of Electronic Packaging 213 Puligandla Viswanadham 6.1
Introduction 214 6.2 Hierarchy of Electronic Packaging. 216 6.3 Substrates,
Carriers, and Laminates 217 6.4 Flexible Laminates 236 6.5 First Level
Packaging /Semiconductor Packaging 237 6.6 Second Level Packaging 247 6.7
Reliability Enhancements 256 6.8 Thermal Management 260 6.9 Summary 261
Acknowledgements 262 References 252 Suggested Reading 262 References 262 7
Delamination and Reliability Issues in Packaged Devices 267 Wei-Sheng Lei
and Ajay Kumar 7.1 Introduction 267 7.2 Basic Aspects of Delamination
Failure 269 7.3 Evaluation of Delamination Initiation in Electronic
Packages 280 7.4 Evaluation of Delamination Propagation in Electronic
Packages 290 7.5 Summary 304 References 305 8 Investigation of the
Mechanisms of Adhesion and Failure in Microelectronic Packages 313 Tanweer
Ahsan and Andrew Schoenberg 8.1 Introduction 313 8.2 Thermal Methods of
Characterizatio 314 8.3 Stresses in Encapsulated Devices 320 8.4 More on
Adhesion of Molding Compounds - Surface Chemical and Morphological Aspects
332 8.5 Summary 337 References 338
Preface xiii Acknowledgements xvi Part 1: Adhesion: Fundamentals and
Measurement 1 Study of Molecular Bonding or Adhesion by Inelastic Electron
Tunneling Spectroscopy, with Special Reference to Microelectronics 3 Robert
R. Mallik 1.1 Introduction 3 1.2 Principles of IETS 6 1.3 Application of
IETS in Microelectronics 13 1.4 Prospects 24 1.5 Summary 26 References 27 2
Adhesion Measurement of Thin Films and Coatings: Relevance to
Microelectronics 33 Wei-Sheng Lei and Ajay Kumar 2.1 Introduction 33 2.2
Mechanical Methods 36 2.3 Laser Based Techniques 51 2.4 Summary and Remarks
56 References 59 Part 2: Ways to Promote/Enhance Adhesion 3 Tailoring of
Interface/Interphase to Promote Metal-Polymer Adhesion 67 Jörg Friedrich
3.1 Introduction 67 3.2 New Concepts for Ideal Design of Metal-Polymer
Interfaces with Covalently Bonded Flexible Spacer Molecules 87 3.3
Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate 92
3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin
Surfaces 94 3.5 Methods for Producing Monosort Functional Groups at
Polyolefin Surfaces 103 3.6 Reactions and Bond Formation at the Interface
110 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces 112 3.8 Summary
and Conclusions 121 Acknowledgement 123 References 123 4 Atmospheric and
Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in
Microelectronics Packaging 137 Hang Yu, Yiyuan Zhang, Anita Wong, Igor M.
De Rosa, Han S. Chueh, Misha Grigoriev, Thomas S. Williams, Tommy Hsu, and
Robert F. Hicks 4.1 Introduction 137 4.2 Plasma Fundamentals 139 4.3 Survey
of Vacuum Plasma Treatment of Polymers 146 4.4 Survey of Atmospheric
Pressure Plasma Treatment of Polymers 151 4.5 Atmospheric Pressure Plasma
Activation of Polymer Materials Relevant to Microelectronics 153 4.6 Vacuum
Versus Atmospheric Plasmas for Use in Semiconductor Packaging 165
References 166 5 Isotropic Conductive Adhesive Interconnect Technology in
Electronics Packaging Applications 173 James E. Morris and Liang Wang 5.1
Introduction 173 5.2 ICA Technology 174 5.3 Technology Reviews 176 5.4
Electrical Properties 176 5.5 Mechanical Properties 180 5.6 Thermal
Properties 181 5.7 Metallic Filler 181 5.8 Polymer Materials 184 5.9
Reliability 186 5.10 Dispensation 188 5.11 Environmental Properties 189
5.12 Other Results 189 5.13 Summary 190 5.14 Prospects 190 References 191
Part 3: Reliability and Failure Mechanisms 6 Role of Adhesion Phenomenon in
the Reliability of Electronic Packaging 213 Puligandla Viswanadham 6.1
Introduction 214 6.2 Hierarchy of Electronic Packaging. 216 6.3 Substrates,
Carriers, and Laminates 217 6.4 Flexible Laminates 236 6.5 First Level
Packaging /Semiconductor Packaging 237 6.6 Second Level Packaging 247 6.7
Reliability Enhancements 256 6.8 Thermal Management 260 6.9 Summary 261
Acknowledgements 262 References 252 Suggested Reading 262 References 262 7
Delamination and Reliability Issues in Packaged Devices 267 Wei-Sheng Lei
and Ajay Kumar 7.1 Introduction 267 7.2 Basic Aspects of Delamination
Failure 269 7.3 Evaluation of Delamination Initiation in Electronic
Packages 280 7.4 Evaluation of Delamination Propagation in Electronic
Packages 290 7.5 Summary 304 References 305 8 Investigation of the
Mechanisms of Adhesion and Failure in Microelectronic Packages 313 Tanweer
Ahsan and Andrew Schoenberg 8.1 Introduction 313 8.2 Thermal Methods of
Characterizatio 314 8.3 Stresses in Encapsulated Devices 320 8.4 More on
Adhesion of Molding Compounds - Surface Chemical and Morphological Aspects
332 8.5 Summary 337 References 338
Measurement 1 Study of Molecular Bonding or Adhesion by Inelastic Electron
Tunneling Spectroscopy, with Special Reference to Microelectronics 3 Robert
R. Mallik 1.1 Introduction 3 1.2 Principles of IETS 6 1.3 Application of
IETS in Microelectronics 13 1.4 Prospects 24 1.5 Summary 26 References 27 2
Adhesion Measurement of Thin Films and Coatings: Relevance to
Microelectronics 33 Wei-Sheng Lei and Ajay Kumar 2.1 Introduction 33 2.2
Mechanical Methods 36 2.3 Laser Based Techniques 51 2.4 Summary and Remarks
56 References 59 Part 2: Ways to Promote/Enhance Adhesion 3 Tailoring of
Interface/Interphase to Promote Metal-Polymer Adhesion 67 Jörg Friedrich
3.1 Introduction 67 3.2 New Concepts for Ideal Design of Metal-Polymer
Interfaces with Covalently Bonded Flexible Spacer Molecules 87 3.3
Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate 92
3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin
Surfaces 94 3.5 Methods for Producing Monosort Functional Groups at
Polyolefin Surfaces 103 3.6 Reactions and Bond Formation at the Interface
110 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces 112 3.8 Summary
and Conclusions 121 Acknowledgement 123 References 123 4 Atmospheric and
Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in
Microelectronics Packaging 137 Hang Yu, Yiyuan Zhang, Anita Wong, Igor M.
De Rosa, Han S. Chueh, Misha Grigoriev, Thomas S. Williams, Tommy Hsu, and
Robert F. Hicks 4.1 Introduction 137 4.2 Plasma Fundamentals 139 4.3 Survey
of Vacuum Plasma Treatment of Polymers 146 4.4 Survey of Atmospheric
Pressure Plasma Treatment of Polymers 151 4.5 Atmospheric Pressure Plasma
Activation of Polymer Materials Relevant to Microelectronics 153 4.6 Vacuum
Versus Atmospheric Plasmas for Use in Semiconductor Packaging 165
References 166 5 Isotropic Conductive Adhesive Interconnect Technology in
Electronics Packaging Applications 173 James E. Morris and Liang Wang 5.1
Introduction 173 5.2 ICA Technology 174 5.3 Technology Reviews 176 5.4
Electrical Properties 176 5.5 Mechanical Properties 180 5.6 Thermal
Properties 181 5.7 Metallic Filler 181 5.8 Polymer Materials 184 5.9
Reliability 186 5.10 Dispensation 188 5.11 Environmental Properties 189
5.12 Other Results 189 5.13 Summary 190 5.14 Prospects 190 References 191
Part 3: Reliability and Failure Mechanisms 6 Role of Adhesion Phenomenon in
the Reliability of Electronic Packaging 213 Puligandla Viswanadham 6.1
Introduction 214 6.2 Hierarchy of Electronic Packaging. 216 6.3 Substrates,
Carriers, and Laminates 217 6.4 Flexible Laminates 236 6.5 First Level
Packaging /Semiconductor Packaging 237 6.6 Second Level Packaging 247 6.7
Reliability Enhancements 256 6.8 Thermal Management 260 6.9 Summary 261
Acknowledgements 262 References 252 Suggested Reading 262 References 262 7
Delamination and Reliability Issues in Packaged Devices 267 Wei-Sheng Lei
and Ajay Kumar 7.1 Introduction 267 7.2 Basic Aspects of Delamination
Failure 269 7.3 Evaluation of Delamination Initiation in Electronic
Packages 280 7.4 Evaluation of Delamination Propagation in Electronic
Packages 290 7.5 Summary 304 References 305 8 Investigation of the
Mechanisms of Adhesion and Failure in Microelectronic Packages 313 Tanweer
Ahsan and Andrew Schoenberg 8.1 Introduction 313 8.2 Thermal Methods of
Characterizatio 314 8.3 Stresses in Encapsulated Devices 320 8.4 More on
Adhesion of Molding Compounds - Surface Chemical and Morphological Aspects
332 8.5 Summary 337 References 338