eBook, PDF

Low Dielectric Constant Materials for IC Applications (eBook, PDF)

Beschreibung

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Technische Details

• Geräte: PC
• ohne Kopierschutz
• Größe: 5.1MB

Barrierefreiheit

• Text-to-Speech

Autor

Paul S. Ho, University of Texas at Austin, Austin, TX, USA / Wei W. Lee, Taiwan Semiconductor Manufacturing Co., Hsin-chu, Taiwan / Jihperng Leu, Intel Corp., Hillsboro, IL, USA

Produktdetails

• Verlag: Springer Berlin Heidelberg
• Seitenzahl: 310
• Erscheinungstermin: 6. Dezember 2012
• Englisch
• ISBN-13: 9783642559082
• Artikelnr.: 53084130

Rezensionen

From the reviews:

Praise for P.S. Ho, J. Leu, and W.W. Lee, Ed's, Low Dielectric Constant Materials for IC Applications

Electrical Insulation Magazine

"Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researches, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library."

"This text addresses the latest advances in low-k materials, thin film characterization, integration into copper interconnection processing, and reliability for microelectronics applications. ... Because this volume

contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researchers, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." (IEEE Electrical Insulation Magazine, Vol. 20 (2), March/April, 2004)

"This book addresses issues on the development, characterization and integration of low dielectric constant (k) materials for advanced on-chip interconnects. ... this book illustrates in a comprehensive way the technological challenges brought by the introduction of low-k materials into semiconductor manufacturing. ... Being intended to researchers and engineers active in the field of semiconductor processing, it can be used as an introductory book ... . Highly appreciated." (Jean - Francois de Marneffe, Physicalia, Vol. 25 (4), 2003)