This might be the first book that deals mostly with the 3D technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including design for manufacturing (DFM), and from device modeling to SPICE parameter extraction. This book offers an innovative and new approach toward the teaching of the fundamentals of semiconductor process and device design using advanced TCAD simulations of various semiconductor structures.
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