Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology (eBook, PDF)
John H. Lau
eBook, PDF

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology (eBook, PDF)

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This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets an...

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