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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces (eBook, PDF)

High Performance Compute and System-in-Package

Redaktion: Keser, Beth; Kröhnert, Steffen
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Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced applicat...

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