M. Alexe / U. Gösele (eds.)

Gebundenes Buch

Wafer Bonding

Applications and Technology

Ed. by M. Alexe and U. Gösele

Beschreibung

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator,photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Autor

M. Alexe, Max-Planck-Institut for Microstructure Physics, Halle, Germany / U. Gösele, Max-Planck-Institut for Microstructure Physics, Halle, Germany

Produktdetails

• Springer Series in Materials Science Vol.75
• Verlag: Springer, Berlin
• 2004
• Seitenzahl: 520
• Erscheinungstermin: 14. Mai 2004
• Englisch
• Abmessung: 241mm x 160mm x 37mm
• Gewicht: 844g
• ISBN-13: 9783540210498
• ISBN-10: 3540210490
• Artikelnr.: 12634166

Rezensionen

From the reviews:
"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s ... . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)