Two Component Injecton Moulding For Moulded Interconnect Devices
Aminul Islam
Broschiertes Buch

Two Component Injecton Moulding For Moulded Interconnect Devices

2k Moulding for MIDs- Process Analysis and Experimental Investigation

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The moulded interconnect devices (MIDs) contain huge possibilities for many applications in electro- mechanical-systems because of their potential in reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two component (2k) injection moulding is one of the most industrially adaptive processes. However, the use of two component injection moulding for MID fabrication, with circuit patterns in sub-millimeter range, is still a big challenge. This book searches for the technical difficulties associated with the process...