Shuye Zhang, Guoli Sun

Gebundenes Buch

Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging

Beschreibung

There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.

Autor

Shuye Zhang is an associate professor at Harbin Institute of Technology, China. He has been working on electronic packaging areas for 15 years. Currently, he is working on heterogeneous integration, 2.5D packaging, and solder joint reliability.

Produktdetails

• Verlag: Institution of Engineering & Technology
• Seitenzahl: 199
• Erscheinungstermin: 1. Juli 2025
• Englisch
• Abmessung: 234mm x 156mm x 13mm
• Gewicht: 463g
• ISBN-13: 9781837241408
• ISBN-10: 1837241406
• Artikelnr.: 73360086