TEI'19
Tei'19
Broschiertes Buch

TEI'19

Proceedings of the Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction

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Welcome to ACM TEI 2019, the 13th International Conference on Tangible, Embedded and Embodied Interactions, hosted in Tempe, Arizona, United States, from the 17th to the 20th of March 2019. The TEI conference features top-tier work that addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. Over the past few years, TEI research has increasingly embraced hybridity, whether through material explorations of composit...