Systems, Software and Services Process Improvement
30th European Conference, EuroSPI 2023, Grenoble, France, August 30 - September 1, 2023, Proceedings, Part II
Herausgegeben: Yilmaz, Murat; Clarke, Paul; Riel, Andreas; Messnarz, Richard
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This two-volume set constitutes the refereed proceedings of the 30th European Conference on Systems, Software and Services Process Improvement, EuroSPI 2023, held in Grenoble, France, in August-September 2023.The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and...
This two-volume set constitutes the refereed proceedings of the 30th European Conference on Systems, Software and Services Process Improvement, EuroSPI 2023, held in Grenoble, France, in August-September 2023.
The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; sustainability and life cycle challenges; SPI and recent innovations; virtual reality and augmented reality.
The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; sustainability and life cycle challenges; SPI and recent innovations; virtual reality and augmented reality.
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