Study of SnAgCu Alloy Reliability
Krishna Tunga
Broschiertes Buch

Study of SnAgCu Alloy Reliability

Material Microstructural Evolution and Laser Moire Interferometry

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This work aims to understand the reliability ofSnAgCu solder interconnects used in PBGA packagesusing microstructure evolution, laser moiréinterferometry and finite-element modeling. Aparticle coarsening based microstructure evolution ofthe solder joint material during thermal excursionswas studied for extended periods of time lasting forseveral months. The microstructure evolution andparticle coarsening was quantified, and accelerationfactors were determined between benign field-useconditions and ATC conditions for PBGA packages withdifferent form factors and for two differentlead-free solde...