Gebundenes Buch

Sic Power Module Design: Performance, Robustness and Reliability

Beschreibung

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.

Produktdetails

• Energy Engineering
• Verlag: Institution of Engineering & Technology
• Seitenzahl: 360
• Erscheinungstermin: 3. Februar 2022
• Englisch
• Abmessung: 239mm x 160mm x 25mm
• Gewicht: 662g
• ISBN-13: 9781785619076
• ISBN-10: 1785619071
• Artikelnr.: 61504225